Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
View Top Employees from Amkor Technology, Inc.Website | https://amkor.com |
Ticker | AMKR |
Revenue | $4.32 billion |
Funding | $385 million |
Employees | 7,391 (4,572 on RocketReach) |
Founded | 1968 |
Address | 2045 East Innovation Circle, Tempe, Arizona 85284, US |
Phone | (480) 821-5000 |
Fax | (480) 821-8276 |
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Industry | Electronics, Semiconductor Manufacturing, Semiconductors, Manufacturing, Consumer Electronics, IC Test, Hardware, Package Design, Semiconductor, Wafer Bumping, Science and Engineering, MEMS & Sensors, Wireless, Wafer Level Packaging, Mobile, Copper Pillar, 3D Packaging, TSV, Copper Wirebond, Flip Chip, Package-on-Package, SiP, TMV, Chip-on-Chip, Wafer Test, Die Processing & Inspection, RF/Wireless Design, Strip Test |
Competitors | Integrated Micro-Electronics, Inc. (IMI Global), SPIL, STATS ChipPAC Ltd., Unisem, 華泰電子股份有限公司 Orient Semiconductor Electronics |
SIC | SIC Code 36 Companies, SIC Code 367 Companies |
NAICS | NAICS Code 3345 Companies, NAICS Code 334 Companies, NAICS Code 33 Companies, NAICS Code 334516 Companies, NAICS Code 33451 Companies |
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The Amkor Technology, Inc. annual revenue was $4.32 billion in 2024.
Kevin Haskew is the Corporate Vice President and Chief Information Officer of Amkor Technology, Inc..
4,572 people are employed at Amkor Technology, Inc..
Amkor Technology, Inc. is based in Tempe, Arizona.
The NAICS codes for Amkor Technology, Inc. are [3345, 334, 33, 334516, 33451].
The SIC codes for Amkor Technology, Inc. are [36, 367].