Ji Park Email & Phone Number
SVP, Advanced Packaging - CHIPS for America - Wafer Level @ Amkor Technology, Inc.
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Ji Park Location
- California, United States
Ji Park Work
- SVP, Advanced Packaging - CHIPS for America - Wafer Level @ (January 2016 - Present)
- Vice President, Product Management - Biometrics - Fingerprint Sense ID - Ultrasonic Fingerprint @ (January 2014 - January 2016)
- Vice President, Product Management - Smart TV, STB, DMA, IOT Devices @ (January 2011 - January 2014)
- VP and GM , Video Business Unit - Video Processor, Display Controller and Video Interface Products @ (January 2006 - January 2011)
- General Manager Timing Products - Memory Interface @ (January 2003 - January 2006)
- Sr Business Development Manager - WI-FI products Network Processors @ (January 2002 - January 2003)
- Sr Marketing Manager - Broadband Communications ( xDSL, Residential Gateway, Network Processor) @ (January 2000 - January 2002)
- Strategic Marketing Manager - Advanced Logic and Linear Products @ (January 1996 - January 2000)
Ji Park Education
- The University of Texas at Austin
- The University of Dallas
Master of Business Administration (MBA)
Ji Park Skills
- Product Management
- Semiconductors
- Cross-functional Team Leadership
- IC
- Product Marketing
- Analog
- Embedded Systems
- Wireless
- ASIC
- Strategic Partnerships
- Strategic Planning
- P&L Management
- Project Management
- Go-to-market Strategy
- Public Speaking
- Business Development
- Account Management
- Defining Product Requirements
- Contract Negotiation
- Pricing Strategy
- Forecasting
- Marketing Communications
- SoC
- Semiconductor Industry
- Product Development
- Electronics
- Mobile Devices
- Consumer Electronics
- WiFi
- Competitive Analysis
- Start-ups
- Management
- Program Management
- Mixed Signal
- Embedded Software
- Telecommunications
- Business Strategy
- Networking
- Engineering Management
- System Architecture
- Processors
- New Business Development
- Integration
- Product Launch
- Product Lifecycle Management
- Mobile Technology
- Digital Signal Processors
- Marketing
- Business Alliances
- Mobile Communications
- Leadership
- Cross Functional Team
- Microsoft Excel
- Start Ups
- Strategy
- Cross Functional Team Leadership
- Defining Product
- Go To Market Strategy
- Product Lifecycle
- Digital Signal
- Microsoft Office
- Video Editing
- Business Analysis
- Troubleshooting
- Social Media
Ji Park Summary
- Ji Park, based in California, United States, is currently a SVP, Advanced Packaging - CHIPS for America - Wafer Level at Amkor Technology. Ji Park brings experience from previous roles at Qualcomm, Integrated Device Technology and Integrated Circuit Systems, Inc.. Ji Park holds a The University of Texas at Austin. With a robust skill set that includes Product Management, Semiconductors, Cross-functional Team Leadership, IC, Product Marketing and more. Ji Park has 2 emails and 1 mobile phone numbers on RocketReach.
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