STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
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The STATS ChipPAC Ltd. annual revenue was $1 billion in 2026.
Jeanne Tabone is the Chief of Staff of STATS ChipPAC Ltd..
63 people are employed at STATS ChipPAC Ltd..
STATS ChipPAC Ltd. is based in Singapore, Central Singapore.
The NAICS codes for STATS ChipPAC Ltd. are [33, 33441, 3344, 334, 3345, 33451].
The SIC codes for STATS ChipPAC Ltd. are [38, 382].