Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world's most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF,analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling. Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Gopeng, Malaysia and Chengdu, People's Republic of China. Unisem is headquartered in Kuala Lumpur, Malaysia.
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The Unisem annual revenue was $307.9 million in 2026.
John Chia is the Chairman of Unisem.
632 people are employed at Unisem.
Unisem is based in Kuala Lumpur, Kuala Lumpur.
The NAICS codes for Unisem are [33, 3332, 333].
The SIC codes for Unisem are [367, 35, 36, 355].