Robert Lanzone Email & Phone Number
Senior Vice President System in Package Product Line at Amkor Technology @ Amkor Technology, Inc.
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Robert Lanzone Location
- United States
Robert Lanzone Work
- 2014 -now Senior Vice President System in Package Product Line at Amkor Technology @
- 2007 -2014 Senior Vice President Advanced Wafer Level and Packaging Development @
- 2004 -2007 Vice President Strategic Marketing and Corporate Business Development @
- 2003 -2004 Vice President Global Business Development @
- 2003 -2003 Chief Executive Officer and President @ Coviant
- 1999 -2003 Vice President Sales and Marketing @ Unitive, Inc.
- 1987 -1995 Advisory Development Engineering Manager @
- now General Manager Advanced Technology Development @
Robert Lanzone Education
- New York University 1978-1982
Robert Lanzone Skills
- Product Marketing
- Optics
- Packaging
- Technology
- Engineering Management
- Strategic Partnerships
- Lean Manufacturing
- Start Ups
- Electronics
- Business Development
- Engineering
- Strategy
- Program Management
- Semiconductor Industry
- New Business Development
- Testing
- Cross Functional Team Leadership
- Manufacturing
- Product Management
- Failure Analysis
- Semiconductors
- Product Development
- Process Engineering
- SPC
- Marketing Strategy
- Flip Chip
- R&D
- IC
Robert Lanzone Summary
- Robert Lanzone, based in United States, is currently a Senior Vice President System in Package Product Line at Amkor Technology at Amkor Technology. Robert Lanzone brings experience from previous roles at Amkor Technology, Stats Chippac Ltd. and Coviant. Robert Lanzone holds a 1978 - 1982 New York University. With a robust skill set that includes Product Marketing, Optics, Packaging, Technology, Engineering Management and more. Robert Lanzone has 2 emails and 1 mobile phone numbers on RocketReach.
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