Robert Lanzone Email & Phone Number

Corporate Vice President System in Package Business Unit @ Amkor Technology, Inc.

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Robert Lanzone Location

Chandler, AZ, US

Robert Lanzone Work

2023 - now Corporate Vice President System in Package Business Unit @ Amkor Technology, Inc.
2014 - 2022 Sr. VP System in Package Product Line @ Amkor Technology, Inc.
2007 - 2014 Sr. VP Advanced Wafer Level and Packaging Development @ Amkor Technology, Inc.

2004 - 2007 VP Strategic Marketing and Corporate Business Development @ Amkor Technology, Inc.
2003 - 2004 VP Global Business Development @ STATS ChipPAC Ltd.
2003 - 2003 CEO and President @ Coviant Inc
1999 - 2003 VP Sales and Marketing @ Unitive, Inc.
1995 - 1999 GM Advanced Technology Development @ Kyocera Communications, Inc.
1987 - 1995 Advisory Development Engineering Manager @ IBM
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Robert Lanzone Education

New York University - Polytechnic School of Engineering
1978 - 1982
St Vincent

Robert Lanzone Skills

Product Development
Lean Manufacturing
Semiconductors

Manufacturing
Start-ups
Strategy
Optics
Electronics
Semiconductor Industry
Strategic Partnerships

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Robert Lanzone Summary

Robert Lanzone, based in Chandler, AZ, US, is currently a Corporate Vice President System in Package Business Unit at Amkor Technology, Inc.. Robert Lanzone brings experience from previous roles at Amkor Technology and ChipPAC. Robert Lanzone holds a 1978 - 1982 New York University - Polytechnic School of Engineering. With a robust skill set that includes Product Development, Lean Manufacturing, Semiconductors, Manufacturing, Start-ups and more. Robert Lanzone has 2 emails and 1 mobile phone numbers on RocketReach.

Robert Lanzone Emails

Found 2 emails

Robert Lanzone Phone Numbers

Found 4 phone numbers

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