Robert Lanzone Email & Phone Number
Corporate Vice President System in Package Business Unit @ Amkor Technology, Inc.
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Robert Lanzone Location
- Chandler, AZ, US
Robert Lanzone Work
- 2023 -now Corporate Vice President System in Package Business Unit @
- 2014 -2022 Sr. VP System in Package Product Line @
- 2007 -2014 Sr. VP Advanced Wafer Level and Packaging Development @
- 2004 -2007 VP Strategic Marketing and Corporate Business Development @
- 2003 -2004 VP Global Business Development @
- 2003 -2003 CEO and President @ Coviant Inc
- 1999 -2003 VP Sales and Marketing @ Unitive, Inc.
- 1995 -1999 GM Advanced Technology Development @
- 1987 -1995 Advisory Development Engineering Manager @
Robert Lanzone Education
- New York University - Polytechnic School of Engineering 1978-1982
- St Vincent
Robert Lanzone Skills
- Product Development
- Lean Manufacturing
- Semiconductors
- Manufacturing
- Start-ups
- Strategy
- Optics
- Electronics
- Semiconductor Industry
- Strategic Partnerships
- Process Engineering
- Product Marketing
- Program Management
- Product Management
- Cross-functional Team Leadership
- New Business Development
- Business Development
- Packaging
- Failure Analysis
- SPC
- IC
- Marketing Strategy
- Testing
- Flip Chip
- R&D
- Engineering
- Engineering Management
- Technology
- Start Ups
- Business Analysis
- Sales Management
- Microsoft Excel
- Cross Functional Team Leadership
- Management
Robert Lanzone Summary
- Robert Lanzone, based in Chandler, AZ, US, is currently a Corporate Vice President System in Package Business Unit at Amkor Technology, Inc.. Robert Lanzone brings experience from previous roles at Amkor Technology and ChipPAC. Robert Lanzone holds a 1978 - 1982 New York University - Polytechnic School of Engineering. With a robust skill set that includes Product Development, Lean Manufacturing, Semiconductors, Manufacturing, Start-ups and more. Robert Lanzone has 2 emails and 1 mobile phone numbers on RocketReach.
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