Mun Chew Email
Site Quality Director @ Micron Technology
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Mun Chew Location
- Malaysia
Mun Chew Work
- 2018 -now Site Quality Director @
- 2016 -2018 Director of Field application engineering @
- 2009 -2016 Head of Quality Department (Manufacturing site) @
- 2006 -2009 Manager Quality Assurance @ Unisem-Advan[pack Technology (JV Flip Chip International)
- 1992 -2006 Program manager (Product testing and Manufacturing) @
- 1987 -1992 Process Engineer @
Mun Chew Education
- The Nottingham Trent University
Master of Business Administration (MBA) (General management)
2000-2004 - Ngee Ann Polytechnic
Diploma (Mechanical Engineering)
1983-1986
Mun Chew Skills
- Silicon wafering, Epi, Wafer Bumping, WLCSP, Flip Chip, Assembly & Test
- Silicon Wafering
- Assembly and Test
- Wlcsp
- Flip Chip
- Wafer Bumping
- Epi
Mun Chew Summary
- Mun Chew, based in Malaysia, is currently a Site Quality Director at Micron Technology. Mun Chew brings experience from previous roles at SunEdison Semiconductor, SunEdison, Unisem-Advan[pack Technology (JV Flip Chip International) and Unisem. Mun Chew holds a 2000 - 2004 Master of Business Administration (MBA) in General management @ The Nottingham Trent University. With a robust skill set that includes Silicon wafering, Epi, Wafer Bumping, WLCSP, Flip Chip, Assembly & Test, Silicon Wafering, Assembly and Test, Wlcsp, Flip Chip and more. Mun Chew has 2 emails on RocketReach.
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