Daewon Lee Email & Phone Number
Product and Test Engineer for HBM @ Micron Technology
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Daewon Lee Location
- Boise, ID, US
Daewon Lee Work
- 2024 -now Product and Test Engineer for HBM @
- 2019 -2024 Product Development Engineer @
- 2010 -2019 Product Development Engineer for NAND and NOR and PCM @
- 2002 -2010 Staff Product Engineer for commodity and mobile DRAM @
- 1989 -2002 Lead engineer and part manger for DRAM Product and Test development in R and D @
Daewon Lee Education
- Kwangwoon University
Bachelor’s Degree (Electronics Engineering)
1982-1986
Daewon Lee Skills
- Semiconductors
- Webview
- Aerospace
- MIMO
- LTE
- 3GPP
- Wireless
- Simulations
- Signal Processing
- IEEE 802.11
- Cellular Communications
- Algorithms
- OFDM
- WiFi
- Matlab
- Digital Signal Processors
- Digital Signal Processing
- PHY
- Communication Systems
- Software Engineering
- Standards Development
- Wireless Technologies
- C++
- Orthogonal Frequency Division Multiplexing
- C/C++
- Baseband Algorithms
- Simulation
Daewon Lee Summary
- Daewon Lee, based in Boise, ID, US, is currently a Product and Test Engineer for HBM at Micron Technology. Daewon Lee brings experience from previous roles at Intel Corporation, Micron Technology, Infineon Technologies/ Qimonda and Hynix Semiconductor Inc.. Daewon Lee holds a 1982 - 1986 Bachelor’s Degree in Electronics Engineering @ Kwangwoon University. With a robust skill set that includes Semiconductors, Webview, Aerospace, MIMO, LTE and more. Daewon Lee has 1 emails on RocketReach.
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