Daewon Lee Email & Phone Number
Principal Engineer @ InterDigital, Inc.
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Daewon Lee Location
- New York, NY, US
Daewon Lee Work
- Principal Engineer @ (August 2025 - Present)
- Principal Engineer @ (April 2020 - July 2025)
- Systems Engineer @ (October 2016 - March 2020)
- Principal Architect @ (October 2014 - September 2016)
- Sr. Staff - System Engineer @ (May 2013 - September 2014)
- Sr. Research Engineer @ (January 2010 - July 2011)
- Research Engineer @ (March 2006 - December 2009)
Daewon Lee Education
- Georgia Institute of Technology
Doctor of Philosophy (Ph.D.) (Electrical Engineering)
2011-2016 - Korea Advanced Institute of Science and Technology
Master’s Degree (Electrical Engineering)
2004-2006 - Korea Advanced Institute of Science and Technology
Bachelor’s Degree (Electrical Engineering)
2000-2004
Daewon Lee Skills
- 3GPP
- 5G NR
- Algorithms
- Baseband Algorithms
- C++
- C/C++
- Cellular Communications
- Communication Systems
- Digital Signal Processing
- Digital Signal Processors
- IEEE 802.11
- LTE
- MIMO
- Matlab
- OFDM
- Orthogonal Frequency-Division Multiplexing (OFDM)
- PHY
- Signal Processing
- Simulation
- Simulations
- Software Development
- Software Engineering
- Standards Development
- Systems Engineering
- WiFi
- Wireless
- Wireless Technologies
- Engineering
- Orthogonal Frequency Division Multiplexing Ofdm
- Digital Signal
- Public Speaking
- Integration
- Orthogonal Frequency Division Multiplexing
Daewon Lee Summary
- Daewon Lee, based in New York, NY, US, is currently a Principal Engineer at InterDigital, Inc.. Daewon Lee brings experience from previous roles at Intel Corporation, Newracom and Broadcom. Daewon Lee holds a 2011 - 2016 Doctor of Philosophy (Ph.D.) in Electrical Engineering @ Georgia Institute of Technology. With a robust skill set that includes 3GPP, 5G NR, Algorithms, Baseband Algorithms, C++ and more. Daewon Lee has 2 emails and 4 mobile phone numbers on RocketReach.
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