AiPac, Inc. Information

AiPac (Advanced Integrated Packaging) was founded in early 2016 by Tri Minh Hoang, President and CEO, to implement his vision of putting the resources in place to rapidly develop electronic products while optimizing cost and performance. As a very experienced systems, telecom and cloud computing engineer, Tri saw the inefficiencies in today’s sequential multi-vendor and multi-discipline approach for developing products. He envisioned a single vendor with the multi-disciplines to develop a product “From Concept to Reality.” AiPac is the embodiment of that vision. AiPac is building the largest semiconductor assembly facility in North America in our 28k sq2 Fremont, CA facility. AiPac’s vision is much broader than building a US-based advanced packaging company. AiPac is integrating system component design, IC design and packaging design with an incubator environment with strategic partners and a SMT (surface mount technology) to truly deliver “From Concept to Reality” capabilities with the goal of providing a complete ecosystem for rapid and cost effective product development.