2004 -
2014 Principal Hardware Engineer @ CSP, Inc.
2004 -
2014 Principal Hardware Engineer; Continued @ CSP, Inc.
2002 -
2002 FPGA Design Engineer (Contract) @ Terapulse, Inc.
1999 -
2002 Principal Hardware Engineer @ Gotham Networks
Wayne Boland Education
Boston University 2024
University of Massachusetts Lowell 2024
Wayne Boland Skills
Ethernet
Hardware
Development
Switching
Design
PCB design
Embedded Systems
PCIe
Processors
Testing
Hardware Architecture
Signal Integrity
FPGA
Xilinx
High Speed Interfaces
Debugging
Schematic Capture
Wayne Boland Summary
Wayne Boland, based in Marlborough, MA, US, is currently a Specialist at MIT Lincoln Laboratory. Wayne Boland brings experience from previous roles at CSP, Inc., Terapulse, Inc. and Gotham Networks. Wayne Boland holds a Boston University. With a robust skill set that includes Ethernet, Hardware, Development, Switching, Design and more. Wayne Boland has 1 emails and 1 mobile phone numbers on RocketReach.
Get contact details of over 700M profiles across 60M companies - all with industry-leading accuracy. Sales and Recruiter users, try out our Email Finder Extension.
Use our AI-Powered Email Finder
Find business and personal emails and mobile phone numbers with exclusive coverage across niche job titles, industries, and more for unparalleled targeting. Also available via our Contact Data API.