Wade Guo Email
MTS, Mobile Packaging Development @ Micron Technology
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Wade Guo Location
- Shanghai, China
Wade Guo Work
- 2017 -now MTS, Mobile Packaging Development @
- 2013 -2017 Principal Packaging Engineer, NPI and Pathfinding @
- 2009 -2013 Manager, Packaging NPI @
- 2007 -2009 Senior Packaging Engineer, R and D @
- 2005 -2007 Packaging Engineer @
Wade Guo Education
- Southeast University
BS (Mechanical Engineering)
Wade Guo Skills
- Engineering Management
- Reliability
- Statistical Process Control Spc
- Analog
- Electronics
- Automotive
- FMEA
- Engineering
- Product Lifecycle Management
- Integrated Circuits Ic
- Semiconductor Industry
- Cross Functional Team Leadership
- Manufacturing
- Design of Experiments
- Failure Mode And Effects Analysis Fmea
- Failure Analysis
- Management
- Semiconductors
- Project Management
- Product Development
- SPC
- Continuous Improvement
- R&D
- Yield
- Statistical Process Control
- Integrated Circuits
- Failure Mode and Effects Analysis
Wade Guo Summary
- Wade Guo, based in Shanghai, China, is currently a MTS, Mobile Packaging Development at Micron Technology. Wade Guo brings experience from previous roles at SanDisk®, JCET Group, Diodes Incorporated and ASE Group Global. Wade Guo holds a BS in Mechanical Engineering @ Southeast University. With a robust skill set that includes Engineering Management, Reliability, Statistical Process Control Spc, Analog, Electronics and more. Wade Guo has 4 emails on RocketReach.
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