ASIC Product Design - Packaging Technical Lead @ Intel CEG GTM Custom Silicon and ASICs (March 2024 - January 2026)
Research and Development Engineer @ (December 2020 - June 2024)
Package Design Engineer and Manager @ Intel (April 2012 - December 2020)
Senior Package Design Engineer @ (July 2009 - April 2012)
Package Co-Design Engineer @ (April 2007 - May 2009)
IC and Package Co-Design Engineer @ (January 2000 - January 2006)
Process Engineering and Package Designer @ Motorola (January 1990 - January 2000)
Todd Snider Education
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Todd Snider Skills
Solidworks
Pro Engineer
PTC Creo
Finite Element Analysis
Manufacturing
Geometric Dimensioning And Tolerancing
Todd Snider Summary
Todd Snider, based in United States, is currently a Applications Engineer - Architecture at Cadence. Todd Snider brings experience from previous roles at Intel CEG GTM Custom Silicon and ASICs, Intel Corporation, Intel and Bayside Design In.. Todd Snider holds a ---. With a robust skill set that includes Solidworks, Pro Engineer, PTC Creo, Finite Element Analysis, Manufacturing and more. Todd Snider has 3 emails and 2 mobile phone numbers on RocketReach.
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