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Todd Snider Location
United States
Todd Snider Work
2026 -now Applications Engineer - Architecture @
2024 -2026 ASIC Product Design - Packaging Technical Lead @ Intel CEG GTM Custom Silicon and ASICs
2020 -2024 Research and Development Engineer @
2012 -2020 Package Design Engineer and Manager @ Intel
2009 -2012 Senior Package Design Engineer @
2007 -2009 Package Co-Design Engineer @
2000 -2006 IC and Package Co-Design Engineer @
1990 -2000 Process Engineering and Package Designer @ Motorola
Todd Snider Education
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Todd Snider Skills
Solidworks
Pro Engineer
PTC Creo
Finite Element Analysis
Manufacturing
Geometric Dimensioning And Tolerancing
Todd Snider Summary
Todd Snider, based in United States, is currently a Applications Engineer - Architecture at Cadence. Todd Snider brings experience from previous roles at Intel CEG GTM Custom Silicon and ASICs, Intel Corporation, Intel and Bayside Design In.. Todd Snider holds a ---. With a robust skill set that includes Solidworks, Pro Engineer, PTC Creo, Finite Element Analysis, Manufacturing and more. Todd Snider has 3 emails and 2 mobile phone numbers on RocketReach.
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