Ryan Payne Email & Phone Number
Senior Director, Head of SSD Hardware Engineering @ SanDisk®
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Ryan Payne Location
- Lake Forest, CA, US
Ryan Payne Work
- 2025 -now Senior Director, Head of SSD Hardware Engineering @
- 2024 -2025 Senior Director, Head of SSD Hardware Engineering @
- 2021 -2024 Director, SSD Hardware Validation @
- 2020 -2021 Senior Engineering Manager, Enterprise HDD and SSD Hardware Validation @
- 2016 -2019 Engineering Manager, PCBA Electronics and EMC Validation @
- 2015 -2016 Engineering Associate Manager, PCBA Electronics and EMC Validation @
- 2013 -2015 Staff Electronics Design Engineer @
- 2010 -2013 Sr. Electronics Design Engineer @
- 2008 -2010 Electronic Design Engineer @
- 2007 -2007 Test Intern @ Esterline Palomar Products
- 2006 -2006 Design Intern @
- 2004 -2004 Tech Intern @
Ryan Payne Education
- San Diego State University-California State University
Bachelor of Science (B.S.) (Electrical Engineering)
2003-2008 - University of Oxford
(Optoelectronics)
2007-2007
Ryan Payne Skills
- Soldering
- Multimeter
- hyperlynx simulation for ddr routing
- TDR and scope measurements
- Thermal Analysis
- EMI
- emissions and susceptibility for FCC regulations
- PCB Design
- Electronics
- Simulations
- Engineering
- Engineering Management
Ryan Payne Summary
- Ryan Payne, based in Lake Forest, CA, US, is currently a Senior Director, Head of SSD Hardware Engineering at Sandisk. Ryan Payne brings experience from previous roles at Western Digital. Ryan Payne holds a 2003 - 2008 Bachelor of Science (B.S.) in Electrical Engineering @ San Diego State University-California State University. With a robust skill set that includes Soldering, Multimeter, hyperlynx simulation for ddr routing, TDR and scope measurements, Thermal Analysis and more. Ryan Payne has 2 emails and 1 mobile phone numbers on RocketReach.
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