Ryan Payne Email & Phone Number
Senior Director, Head of SSD Hardware Engineering @ SanDisk®
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Ryan Payne Location
- Lake Forest, CA, US
Ryan Payne Work
- Senior Director, Head of SSD Hardware Engineering @ (February 2025 - Present)
- Senior Director, Head of SSD Hardware Engineering @ (February 2024 - February 2025)
- Director, SSD Hardware Validation @ (September 2021 - January 2024)
- Senior Engineering Manager, Enterprise HDD and SSD Hardware Validation @ (January 2020 - September 2021)
- Engineering Manager, PCBA Electronics and EMC Validation @ (July 2016 - December 2019)
- Engineering Associate Manager, PCBA Electronics and EMC Validation @ (February 2015 - June 2016)
- Staff Electronics Design Engineer @ (July 2013 - February 2015)
- Sr. Electronics Design Engineer @ (December 2010 - June 2013)
- Electronic Design Engineer @ (July 2008 - November 2010)
- Test Intern @ Esterline Palomar Products (April 2007 - August 2007)
- Design Intern @ (May 2006 - August 2006)
- Tech Intern @ (June 2004 - August 2004)
Ryan Payne Education
- San Diego State University
Bachelor of Science (B.S.) (Electrical Engineering)
2003-2008 - University of Oxford
(Optoelectronics)
2007-2007
Ryan Payne Skills
- Soldering
- Multimeter
- hyperlynx simulation for ddr routing
- TDR and scope measurements
- Thermal Analysis
- EMI
- emissions and susceptibility for FCC regulations
- PCB Design
- Electronics
- Simulations
- Engineering
- Engineering Management
Ryan Payne Summary
- Ryan Payne, based in Lake Forest, CA, US, is currently a Senior Director, Head of SSD Hardware Engineering at Sandisk. Ryan Payne brings experience from previous roles at Western Digital. Ryan Payne holds a 2003 - 2008 Bachelor of Science (B.S.) in Electrical Engineering @ San Diego State University. With a robust skill set that includes Soldering, Multimeter, hyperlynx simulation for ddr routing, TDR and scope measurements, Thermal Analysis and more. Ryan Payne has 2 emails and 2 mobile phone numbers on RocketReach.
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