Mark Gerber Email & Phone Number
Sr. Director, Engineering and Technical Marketing Flip Chip and SiP @ 日月光封装测试（上海）有限公司
Mark Gerber's Location
Dallas, TX, US
Mark Gerber's Work
- Sr. Director, Engineering and Technical Marketing Flip Chip and SiP @ 日月光封装测试（上海）有限公司
- Director, Engineering and Technical Marketing-Flip Chip and System-in-Package @ 日月光封装测试（上海）有限公司
- Strategic R and D Package Engineering- Analog and CMOS - SMTS @ Texas Instruments
- Manager, CMOS Pkg Technology Development and Execution @ Texas Instruments
- Manager, Fine Pitch Cu Pillar Interconnect Packaging Development and Deployment-NPI @ Texas Instruments
- Advanced Package Productization Development Manager @ Texas Instruments
- Packaging Engineer - Wireless Terminal BU Mfg Group -IC Pkg Assy and RF and Modules Mfg Assy @ NXP acquires Freescale Semiconductor
- Packaging Engineer -Networking Computing Systems Group- Package Reliability Group @ NXP acquires Freescale Semiconductor
- Package Development Engineer - New Product Introduction Focus @ Dallas Semiconductor
- Packaging Engineer - New Product Introduction Focus @ Maxim Semiconductor
Mark Gerber's Education
- Texas A&M University
Bachelor of Science (BS) (Mechanical Engineering)
1989 - 1994
Mark Gerber's Skills
- Program Management
- Failure Analysis
- R&d
- Research and Development R&d
- Cross Functional Team Leadership
- CMOS
- IC
- Semiconductors
- Product Engineering
- FMEA
Mark Gerber's Summary
Mark Gerber, based in Dallas, TX, US, is currently a Sr. Director, Engineering and Technical Marketing Flip Chip and SiP at ASE Group Global, bringing experience from previous roles at ASE Group Global and Texas Instruments. Mark Gerber holds a 1989 - 1994 Bachelor of Science (BS) in Mechanical Engineering @ Texas A&M University. With a robust skill set that includes Program Management, Failure Analysis, R&d, Research and Development R&d, Cross Functional Team Leadership and more, Mark Gerber contributes valuable insights to the industry. Mark Gerber has 2 emails on RocketReach.
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