Mark Gerber Email & Phone Number

IC Packaging, Product Management Group Director @ Cadence Design Systems

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Mark Gerber Location

Dallas, TX, US

Mark Gerber Work

IC Packaging, Product Management Group Director @ (July 2025 - Present)
Sr. Director, Engineering and External Technical Marketing -Advanced Packaging @ (February 2015 - July 2025)
Strategic R and D Package Engineering- Analog and CMOS - SMTS @ (February 2013 - May 2014)
Manager, CMOS Pkg Technology Development and Execution @ (October 2011 - February 2013)
Manager, Fine Pitch Cu Pillar Interconnect Packaging Development and Deployment-NPI @ (November 2009 - October 2011)
External Manufacturing Development and Technical Manager @ (October 2005 - November 2009)
Stacked Die and POP Advanced Package NPI Engineering Manager @ (January 2003 - January 2005)
Packaging Engineer - Wireless Terminal BU Mfg Group -IC Pkg Assy and RF and Modules Mfg Assy @ (January 1997 - January 2003)
Packaging Engineer -Networking Computing Systems Group- Package Reliability Group @ (January 1997 - January 2003)
Package Development Engineer - New Product Introduction Focus @ Dallas Semiconductor (January 1993 - January 1997)
Packaging Engineer - New Product Introduction Focus @ Maxim Semiconductor (January 1993 - January 1997)

Mark Gerber Education

Texas A&M University
Bachelor of Science (BS) (Mechanical Engineering)
1989-1994

Mark Gerber Skills

3DIC
ASIC
Advanced Packaging
Advanced Process Control
Analog
Artificial Intelligence (AI)
Assembly Process Technology
Board of Directors
Budget Management
Business Development
Business Strategy
CMOS
Chiplets
Collaborative Problem Solving
Competitive Analysis
Competitive Cost Analysis
Cost Reduction
Creative Problem Solving
Cross-functional Collaborations
Cross-functional Team Leadership
Design for Manufacturing
Design of Experiments
Distuinguished lecturer
Electrical Engineering
Electronics
Engineering
Engineering Management
Establishing Strategic Partnerships
External Manufacturing
FMEA
Failure Analysis
IC
IC packaging
IMAPS Fellow
Innovation Consulting
Innovation Development
Integrated Circuits (IC)
Leadership
MEMS
Management
Manufacturing
Manufacturing Engineering
Manufacturing Operations Management
Manufacturing Process Improvement
Market Analysis
Marketing Strategy
Materials Development
Mechanical Engineering
Microelectronics
Mixed Signal
Mobile Communications
Mobile Technology
Network Reliability
New Product Introduction
Organizational Leadership
P&L Management
Packaging Engineering
Patent
Power Management
Press Releases
Printed Circuit Board (PCB) Design
Product Development
Product Engineering
Product Innovation
Product Strategy
Production Process Development
Program Management
Project Engineering
R&D
Radio Frequency (RF)
Radio Frequency (RF) Engineering
Reliability
Reliability Engineering
Reliability Testing
Research and Development (R&D)
SPC
Semiconductor Industry
Semiconductor Packaging
Semiconductors
Silicon
Strategic Partnerships
Strategic Planning
Strategic Roadmaps
Subcontract Management
Supply Chain Management
Supply Chain Optimization
Supply Management
Team Leadership
Technical Leadership
Technical Marketing
Technological Innovation
Technology Management
Technology Roadmapping
Technology Trends
Telecommunications
Wireless Technologies
Yield
additive manufacturing
networking computing
Research and Development R&d
Cross Functional Team Leadership
Sales
Integrated Circuits Ic
Java
Strategy
Research and Development
Integrated Circuits

Mark Gerber Summary

Mark Gerber, based in Dallas, TX, US, is currently a IC Packaging, Product Management Group Director at Cadence. Mark Gerber brings experience from previous roles at ASE Group Global and Texas Instruments. Mark Gerber holds a 1989 - 1994 Bachelor of Science (BS) in Mechanical Engineering @ Texas A&M University. With a robust skill set that includes 3DIC, ASIC, Advanced Packaging, Advanced Process Control, Analog and more. Mark Gerber has 1 emails and 3 mobile phone numbers on RocketReach.