Mark Gerber Email & Phone Number
Sr. Director, Engineering and External Technical Marketing -Advanced Packaging @ 日月光封装测试（上海）有限公司
Mark Gerber Location
Dallas, TX, US
Mark Gerber Work
- 2015 - now Sr. Director, Engineering and External Technical Marketing -Advanced Packaging @ 日月光封装测试（上海）有限公司
- 2013 - 2014 Strategic R and D Package Engineering- Analog and CMOS - SMTS @ Texas Instruments
- 2011 - 2013 Manager, CMOS Pkg Technology Development and Execution @ Texas Instruments
- 2009 - 2011 Manager, Fine Pitch Cu Pillar Interconnect Packaging Development and Deployment-NPI @ Texas Instruments
- 2003 - 2005 Stacked Die and POP Advanced Package NPI Engineering Manager @ Texas Instruments
- 1997 - 2003 Packaging Engineer - Wireless Terminal BU Mfg Group -IC Pkg Assy and RF and Modules Mfg Assy @ NXP acquires Freescale Semiconductor
- 1997 - 2003 Packaging Engineer -Networking Computing Systems Group- Package Reliability Group @ NXP acquires Freescale Semiconductor
- 1993 - 1997 Package Development Engineer - New Product Introduction Focus @ Dallas Semiconductor
- 1993 - 1997 Packaging Engineer - New Product Introduction Focus @ Maxim Semiconductor
Mark Gerber Education
- Texas A&M University
Bachelor of Science (BS) (Mechanical Engineering)
1989 - 1994
Mark Gerber Skills
- Analog
- Silicon
- Product Development
- Product Engineering
- IC
- Failure Analysis
- CMOS
- Design of Experiments
- Semiconductors
- ASIC
Mark Gerber Summary
Mark Gerber, based in Dallas, TX, US, is currently a Sr. Director, Engineering and External Technical Marketing -Advanced Packaging at ASE Group Global. Mark Gerber brings experience from previous roles at Texas Instruments. Mark Gerber holds a 1989 - 1994 Bachelor of Science (BS) in Mechanical Engineering @ Texas A&M University. With a robust skill set that includes Analog, Silicon, Product Development, Product Engineering, IC and more. Mark Gerber has 2 emails and 3 mobile phone numbers on RocketReach.
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