Ling Pan Email
Senior Package Simulation Engineer @ Micron Technology
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Ling Pan Location
- Singapore
Ling Pan Work
- Senior Package Simulation Engineer @ (January 2014 - Present)
- Simulation enginner (CAE) @ (October 2008 - January 2014)
- Simulation Engineer @ SAE Magnetics (July 2007 - August 2008)
Ling Pan Education
- Harbin Engineering University
(Master's degree, Solid Mechanics)
2005-2007
Ling Pan Skills
- Matlab
- Solidworks
- Robotics
- Electronics
- Testing
- Pro Engineer
- Engineering Management
- Design for Manufacturing
- FMEA
- Design of Experiments
- Manufacturing
- Engineering
- R&D
- Failure Analysis
- Mechanical Engineering
Ling Pan Summary
- Ling Pan, based in Singapore, is currently a Senior Package Simulation Engineer at Micron Technology. Ling Pan brings experience from previous roles at ASM and SAE Magnetics. Ling Pan holds a 2005 - 2007 Harbin Engineering University. With a robust skill set that includes Matlab, Solidworks, Robotics, Electronics, Testing and more. Ling Pan has 1 emails on RocketReach.
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