Lee How Email

Director, APAC Compensation and Benefits @ Micron Technology

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Lee How Location

Singapore

Lee How Work

2019 - now Director, APAC Compensation and Benefits @ Micron Technology
2017 - 2019 Senior Manager, APAC Compensation and Benefits @ Micron Technology
2012 - 2017 Manager, APAC Compensation and Benefits @ Micron Technology

2011 - 2012 Senior Compensation Benefits Analyst @ Micron Technology
2006 - 2011 Senior Engineer @ TECH Semiconductor Singapore

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Lee How Education

National University of Singapore / NUS
Bachelor of Engineering (BEng) (Chemical Engineering)
2002 - 2006

Lee How Skills

Compensation & Benefits Programs
Compensation Strategies
Compensation & Benefit

Compensation Structures
Semiconductor Industry
Manufacturing
Total Rewards
Total Rewards Strategies
Global Compensation
Sales Compensation

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Lee How Summary

Lee How, based in Singapore, is currently a Director, APAC Compensation and Benefits at Micron Technology. Lee How brings experience from previous roles at Micron Technology and TECH Semiconductor Singapore. Lee How holds a 2002 - 2006 Bachelor of Engineering (BEng) in Chemical Engineering @ National University of Singapore / NUS. With a robust skill set that includes Compensation & Benefits Programs, Compensation Strategies, Compensation & Benefit, Compensation Structures, Semiconductor Industry and more. Lee How has 4 emails on RocketReach.

Lee How Emails

Found 4 emails

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