Lee How Email
Director, APAC Compensation and Benefits @ Micron Technology
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Lee How Location
- Singapore
Lee How Work
- Director, APAC Compensation and Benefits @ (February 2019 - Present)
- Senior Manager, APAC Compensation and Benefits @ (March 2017 - January 2019)
- Manager, APAC Compensation and Benefits @ (May 2012 - February 2017)
- Senior Compensation Benefits Analyst @ (April 2011 - April 2012)
- Senior Engineer @ TECH Semiconductor Singapore (June 2006 - March 2011)
Lee How Education
- National University of Singapore / NUS
Bachelor of Engineering (BEng) (Chemical Engineering)
2002-2006
Lee How Skills
- Analytics
- Base Pay
- Compensation
- Compensation & Benefit
- Compensation & Benefits Programs
- Compensation Strategies
- Compensation Structures
- Competitive Analysis
- Data Analysis
- Employee Stock Options
- Global Compensation
- Human Resources (HR)
- Human Resources Information Systems (HRIS)
- Insurance
- Manufacturing
- Project Management
- Restricted Stock
- SAP
- SAP HR
- Sales Compensation
- Sales Compensation Design
- Semiconductor Industry
- Semiconductors
- SuccessFactors
- Total Rewards
- Total Rewards Strategies
- Employee Benefits
- Microsoft Office
- Microsoft Excel
- Compensation and Benefit
- Management
- Compensation and Benefits Programs
- Training
Lee How Summary
- Lee How, based in Singapore, is currently a Director, APAC Compensation and Benefits at Micron Technology. Lee How brings experience from previous roles at Micron Technology and TECH Semiconductor Singapore. Lee How holds a 2002 - 2006 Bachelor of Engineering (BEng) in Chemical Engineering @ National University of Singapore / NUS. With a robust skill set that includes Analytics, Base Pay, Compensation, Compensation & Benefit, Compensation & Benefits Programs and more. Lee How has 1 emails on RocketReach.
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