Lee How Email
Director, APAC Compensation and Benefits @ Micron Technology
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Lee How Location
- Singapore
Lee How Work
- 2019 -now Director, APAC Compensation and Benefits @
- 2017 -2019 Senior Manager, APAC Compensation and Benefits @
- 2012 -2017 Manager, APAC Compensation and Benefits @
- 2011 -2012 Senior Compensation Benefits Analyst @
- 2006 -2011 Senior Engineer @ TECH Semiconductor Singapore
Lee How Education
- National University of Singapore / NUS
Bachelor of Engineering (BEng) (Chemical Engineering)
2002-2006
Lee How Skills
- Compensation & Benefits Programs
- Compensation Strategies
- Compensation & Benefit
- Compensation Structures
- Semiconductor Industry
- Manufacturing
- Total Rewards
- Total Rewards Strategies
- Global Compensation
- Sales Compensation
- Sales Compensation Design
- Base Pay
- Employee Stock Options
- Restricted Stock
- Data Analysis
- Competitive Analysis
- Analytics
- SAP
- SuccessFactors
- Insurance
- Employee Benefits
- Microsoft Office
- Project Management
- Microsoft Excel
- Compensation and Benefit
- Management
- Compensation and Benefits Programs
- Training
Lee How Summary
- Lee How, based in Singapore, is currently a Director, APAC Compensation and Benefits at Micron Technology. Lee How brings experience from previous roles at Micron Technology and TECH Semiconductor Singapore. Lee How holds a 2002 - 2006 Bachelor of Engineering (BEng) in Chemical Engineering @ National University of Singapore / NUS. With a robust skill set that includes Compensation & Benefits Programs, Compensation Strategies, Compensation & Benefit, Compensation Structures, Semiconductor Industry and more. Lee How has 2 emails on RocketReach.
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