Jonathan Reese Email & Phone Number
Senior DRAM Product Engineer @ Micron Technology
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Jonathan Reese Location
- Vienna, VA, US
Jonathan Reese Work
- Senior DRAM Product Engineer @ (June 2021 - Present)
- Yield Enhancement Product Owner @ (August 2017 - June 2021)
- Yield Enhancement Shift Lead Engineer @ (July 2014 - August 2017)
- Real-time Defect Analysis Shift Lead Engineer @ (September 2011 - July 2014)
- Real-time Defect Anaylsis Technology Transfer Engineer @ (March 2010 - September 2011)
- Real-time Defect Analysis Module Engineer @ (June 2008 - March 2010)
- Real-time Defect Analysis Shift Excursion Engineer @ (June 2006 - June 2008)
Jonathan Reese Education
- Rochester Institute of Technology
Bachelor of Applied Science (BASc) (Microelectronic Engineering)
2000-2006 - Sandy Spring Friends School 1996-2000
Jonathan Reese Skills
- JMP
- Manufacturing
- Semiconductors
- Six Sigma
- Design of Experiments
- Failure Analysis
- Microsoft Office
- Project Management
- Engineering
- Product Engineering
- Microsoft Excel
- Product Development
- Strategic Planning
- Electronics
- SPC
- CVD
- CMOS
- Quality Control
- Leadership
- Semiconductor Fabrication
- Defect Identification
- Technology Transfer
- Team Building
- Yield
- DRAM
- NAND Flash
- Cross Sections
- Crucial Confrontations
- Microelectronics
- Metrology
- Semiconductor Industry
- Process Engineering
- IC
- Design of Experiments (DOE)
- Business Analysis
- Semiconductor
- Process Integration
- Microsoft Word
- Management
- Integration
Jonathan Reese Summary
- Jonathan Reese, based in Vienna, VA, US, is currently a Senior DRAM Product Engineer at Micron Technology. Jonathan Reese brings experience from previous roles at Micron Technology. Jonathan Reese holds a 2000 - 2006 Bachelor of Applied Science (BASc) in Microelectronic Engineering @ Rochester Institute of Technology. With a robust skill set that includes JMP, Manufacturing, Semiconductors, Six Sigma, Design of Experiments and more. Jonathan Reese has 3 emails and 1 mobile phone numbers on RocketReach.
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