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Jon Oh Location
Boise, ID, US
Jon Oh Work
Principal Engineer (HBM - High Bandwidth Memory) @ (March 2024 - Present)
Principal Engineer (Managed NAND - UFS) @ (April 2017 - March 2024)
Lead Product Engineer @ (January 2013 - April 2017)
Product Engineer and Senior Product Engineer @ (November 2007 - January 2013)
Jon Oh Education
University of Illinois Urbana-Champaign
Bachelor's degree (Electrical and Electronics Engineering)
2004-2007
Jon Oh Skills
CMOS
DRAM
Design of Experiments
Failure Analysis
IC
JMP
Leadership
NAND Flash
Product Engineering
Project Management
Semiconductors
Jon Oh Summary
Jon Oh, based in Boise, ID, US, is currently a Principal Engineer (HBM - High Bandwidth Memory) at Micron Technology. Jon Oh brings experience from previous roles at Micron Technology. Jon Oh holds a 2004 - 2007 Bachelor's degree in Electrical and Electronics Engineering @ University of Illinois Urbana-Champaign. With a robust skill set that includes CMOS, DRAM, Design of Experiments, Failure Analysis, IC and more. Jon Oh has 2 emails and 1 mobile phone numbers on RocketReach.
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