If you need more lookups,
subscriptions start at $34 USD/month.
Jon Oh Location
Boise, ID, US
Jon Oh Work
2024 -now Principal Engineer (HBM - High Bandwidth Memory) @
2017 -2024 Principal Engineer (Managed NAND - UFS) @
2013 -2017 Lead Product Engineer @
2007 -2013 Product Engineer and Senior Product Engineer @
Jon Oh Education
University of Illinois at Urbana-Champaign
Bachelor's degree (Electrical and Electronics Engineering)
2004-2007
Jon Oh Skills
Semiconductors
CMOS
Product Engineering
Failure Analysis
DRAM
Design of Experiments
IC
NAND Flash
Project Management
JMP
Leadership
Jon Oh Summary
Jon Oh, based in Boise, ID, US, is currently a Principal Engineer (HBM - High Bandwidth Memory) at Micron Technology. Jon Oh brings experience from previous roles at Micron Technology. Jon Oh holds a 2004 - 2007 Bachelor's degree in Electrical and Electronics Engineering @ University of Illinois at Urbana-Champaign. With a robust skill set that includes Semiconductors, CMOS, Product Engineering, Failure Analysis, DRAM and more. Jon Oh has 3 emails and 1 mobile phone numbers on RocketReach.
Looking for a different Jon Oh?
Find contact details for 700 million professionals.