Harry McCaleb Email & Phone Number
IC packaging and Silicon Layout Sr Product Engineer @ Cadence PCB Design and Analysis
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Harry McCaleb Location
- Phoenix, AZ, US
Harry McCaleb Work
- 2025 -now IC packaging and Silicon Layout Sr Product Engineer @
- 2021 -2025 IC Packaging and Silicon Layout Products Sr Manager @
- 1997 -2021 IC Packaging Staff Engineer @
- 1994 -1997 Printed Circuit Board Design Engineer @ Integrated Technology Corporation (ITC)
- 1991 -1994 Industrial Designer @ Weston Design
Harry McCaleb Education
- Massachusetts Institute of Technology
Opencourseware (Engineering Physics/Applied Physics)
2012-2015 - Mesa Community College 1990-1992
- Santa Monica College 1988-1990
- Arizona State University 1982-1986
- Glendale Community College 1980-1982
- Cactus high 1978-1980
- Peoria high 1976-1978
Harry McCaleb Skills
- Semiconductor Engineering
- Printed Circuit Board (PCB) Design
- Electronics
- Reliability
- Orcad
- Semiconductors
- Packaging
- PCB design
- IC
- SPC
- Manufacturing
- Cadence
- Solidworks
- AutoCAD
- Pro Engineer
- Design of Experiments
- Semiconductor Industry
- Silicon
- PTC Creo
- Mixed Signal
- Testing
Harry McCaleb Summary
- Harry McCaleb, based in Phoenix, AZ, US, is currently a IC packaging and Silicon Layout Sr Product Engineer at Cadence System Design and Analysis. Harry McCaleb brings experience from previous roles at Cadence Design Systems, Amkor Technology, Integrated Technology Corporation (ITC) and Weston Design. Harry McCaleb holds a 2012 - 2015 Opencourseware in Engineering Physics/Applied Physics @ Massachusetts Institute of Technology. With a robust skill set that includes Semiconductor Engineering, Printed Circuit Board (PCB) Design, Electronics, Reliability, Orcad and more. Harry McCaleb has 3 emails and 4 mobile phone numbers on RocketReach.
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