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Harry Bloom Location
Boise, ID, US
Harry Bloom Work
Senior Product Line Manager - Embedded Business Unit @ (September 2024 - Present)
Engineering Execution Manager - High Bandwidth Memory Product Engineering @ (March 2022 - January 2025)
Sr. Eng and Team Lead - MNAND MCP Product Engineering @ (January 2019 - January 2022)
Product Engineer and Product Lead - DRAM Product Engineering @ (January 2015 - January 2019)
Leadership Team Chief of Staff @ Micron Young Professionals (January 2020 - January 2021)
Harry Bloom Education
Oregon State University
Bachelor’s Degree (Electrical and Computer Engineering)
2010-2015
Harry Bloom Summary
Harry Bloom, based in Boise, ID, US, is currently a Senior Product Line Manager - Embedded Business Unit at Micron Technology. Harry Bloom brings experience from previous roles at Micron Technology and Micron Young Professionals. Harry Bloom holds a 2010 - 2015 Bachelor’s Degree in Electrical and Computer Engineering @ Oregon State University. Harry Bloom has 2 emails and 1 mobile phone numbers on RocketReach.
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