Feng Ying Email
Deputy GM @ 3PEAK INCORPORATED
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Feng Ying Location
- China
Feng Ying Work
- Deputy GM @ (September 2009 - Present)
- Director of Engineering @ (January 2007 - January 2009)
- Design Manager @ TI (January 2003 - January 2007)
- Engineer @ TI (January 1998 - January 2003)
Feng Ying Education
- University of Michigan
MS (Electrical Engineering)
1994-1998 - Chinese Academy of Sciences
Master (Physics)
1990-1993 - Zhejiang University
BS (Physics)
1986-1990 - The University of Texas at Dallas
Ph.D. (Electrical Engineering)
2004
Feng Ying Skills
- SoC
- Semiconductors
- Mixed Signal
- IC
- ASIC
- Digital Signal Processors
- Semiconductor Industry
- EDA
- Microprocessors
- Debugging
- RF
- Firmware
- Verilog
- Analog
- Functional Verification
- VLSI
- CMOS
- Low-power Design
- RTL design
- DFT
- Static Timing Analysis
- Hardware Architecture
- FPGA
- Integrated Circuit Design
- Processors
- Low Power Design
Feng Ying Summary
- Feng Ying, based in China, is currently a Deputy GM at 3PEAK INCORPORATED. Feng Ying brings experience from previous roles at C2 Microsystems and TI. Feng Ying holds a 1994 - 1998 MS in Electrical Engineering @ University of Michigan. With a robust skill set that includes SoC, Semiconductors, Mixed Signal, IC, ASIC and more. Feng Ying has 3 emails on RocketReach.
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