Brian Chapman Email & Phone Number
Senior Field Application Engineer @ 3PEAK INCORPORATED
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Brian Chapman Location
- Chapel Hill, NC, US
Brian Chapman Work
- Senior Field Application Engineer @ (June 2023 - Present)
- Eastern Regional Sales Manager @ (June 2020 - July 2022)
- Sr. Staff Field Applications Engineer Americas @ (May 2017 - May 2020)
- Sr. Staff Field Application Engineer @ (July 2014 - May 2017)
- Member Technical Staff Apple FAE @ (February 2012 - July 2014)
- Regional Business Mgr. and Principal MTS, Applications @ (October 2006 - September 2011)
- Executive Field Application Engineer @ (April 2001 - September 2006)
- Sr. Account Mgr. and Sr. FAE @ (December 1996 - April 2001)
- Field Application Engineer @ (February 1994 - December 1996)
- Program Manager @ Motorola Inc. (September 1987 - February 1994)
- Photo Electric Sensor Design Engineer @ Micro Switch, A Division of Honeywell (July 1986 - August 1987)
- Analog IC Design Engineer @ General Electric Semiconductor (July 1984 - July 1986)
Brian Chapman Education
- The Ohio State University
BSEE (Electrical Engineering)
- National Technological University
MSEE (Electrical Engineering)
- Virginia Polytechnic Institute and State University
none (Electrical Engineering)
Brian Chapman Skills
- Analog Design
- Product Development
- Product Marketing
- Product Requirements Definition
- Customer Relations
- Sales Presentations
- Sales Growth
- Strategic Communications
- Mixed Signal
- Power Management
- Sales Support
- Automotive
- Semiconductors
- EMI
- ESD control
- System Design
- Business Strategy
- Technical Marketing
- Solution Selling
- IC
- Testing
- Analog Circuit Design
- Analog
- RF
- PCB design
- Electronics
- Wireless
- SERDES
- Mobile Applications
- Semiconductor Industry
- Integrated Circuit Design
- ASIC
- Circuit Design
- SoC
- FPGA
- Power Electronics
- Power Supplies
- Digital Signal Processors
- Product Engineering
- Embedded Systems
- Signal Integrity
- Debugging
- EDA
- PLL
- Silicon
- Hardware Architecture
- Signal Processing
- Microprocessors
- Low-power Design
- Verilog
- Data Systems
- Robotics
- Design
- Low Power Design
Brian Chapman Summary
- Brian Chapman, based in Chapel Hill, NC, US, is currently a Senior Field Application Engineer at 3PEAK INCORPORATED. Brian Chapman brings experience from previous roles at California Eastern Laboratories (CEL), MaxLinear, Exar and Fairchild Semiconductor Inc. Brian Chapman holds a BSEE in Electrical Engineering @ The Ohio State University. With a robust skill set that includes Analog Design, Product Development, Product Marketing, Product Requirements Definition, Customer Relations and more. Brian Chapman has 1 emails and 1 mobile phone numbers on RocketReach.
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