Eric Lv Email
Sr Mgr, Package Engineering Mgmt @ SanDisk®
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Eric Lv Location
- Shanghai, China
Eric Lv Work
- 2008 -now Sr Mgr, Package Engineering Mgmt @
- 2002 -2008 Process Engineering Manager @
- 2004 -2007 MFG Manager @
- 2001 -2001 Chief Process Engineer @
- 1997 -2001 Process Engineering Leader @
Eric Lv Education
- 上海交通大学
硕士 (Master of Engineering, study in school, School of Microelectronics)
2004-2005
Eric Lv Skills
- R
- Engineering Management
- Assembly Language
- Semiconductor Packaging
- Analog
- Electronics
- FMEA
- JMP
- Product Engineering
- Engineering
- Semiconductor Industry
- Readiness
- Cross Functional Team Leadership
- Design of Experiments
- Manufacturing
- Failure Analysis
- Management
- Semiconductors
- Design
- Product Development
- Process Engineering
- SPC
- R&D
- Silicon
- Yield
- IC
- 半导体
- 制造业
- 产品开发
- 半导体行业
- 故障分析
- 试验设计
- 集成电路
- 工艺过程
- 跨职能团队领导力
Eric Lv Summary
- Eric Lv, based in Shanghai, China, is currently a Sr Mgr, Package Engineering Mgmt at SanDisk. Eric Lv brings experience from previous roles at Amkor Technology, Globe Advanced Packaging & Test Co.Ltd (Merged by ASE) and STATS ChipPAC. Eric Lv holds a 2004 - 2005 硕士 in Master of Engineering, study in school, School of Microelectronics @ 上海交通大学. With a robust skill set that includes R, Engineering Management, Assembly Language, Semiconductor Packaging, Analog and more. Eric Lv has 2 emails on RocketReach.
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