Ding Sun Email
Product Engineering @ HP
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Ding Sun Location
- Shanghai, China
Ding Sun Work
- 2018 -now Product Engineering @
- 2018 -now Mechanical Engineer @ Hewlett-Packard Shanghai Co., Ltd
Ding Sun Education
- University of Leeds
Master's Degree (Mechanical Engineering)
2017-2018 - Liverpool John Moores University
Bachelor's Degree (Mechanical Engineering)
2014-2017
Ding Sun Summary
- Ding Sun, based in Shanghai, China, is currently a Product Engineering at HP. Ding Sun brings experience from previous roles at Hewlett-Packard Shanghai Co., Ltd. Ding Sun holds a 2017 - 2018 Master's Degree in Mechanical Engineering @ University of Leeds. Ding Sun has 1 emails on RocketReach.
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