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Brian Seppa Location
Boise, ID, US
Brian Seppa Work
2017 -now Device Characterization Engineer @
now Param Engineering Technician @
Brian Seppa Education
Boise State University
Bachelor of Applied Science - BASc (Electrical, Electronic and Communications Engineering Technology/Technician)
1994-2002
Brian Seppa Skills
Test Equipment
Electronics
Soldering
Brian Seppa Summary
Brian Seppa, based in Boise, ID, US, is currently a Device Characterization Engineer at Micron Technology. Brian Seppa brings experience from previous roles at Micron Technology. Brian Seppa holds a 1994 - 2002 Bachelor of Applied Science - BASc in Electrical, Electronic and Communications Engineering Technology/Technician @ Boise State University. With a robust skill set that includes Test Equipment, Electronics, Soldering and more. Brian Seppa has 1 emails and 1 mobile phone numbers on RocketReach.
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