Bo Yang Email & Phone Number
Distinguished Engineer (Management) @ SanDisk®
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Bo Yang Location
- Milpitas, CA, US
Bo Yang Work
- Distinguished Engineer (Management) @ (February 2025 - Present)
- Researcher (adjunct) @ SLAC/Stanford University (November 2019 - March 2025)
- Distinguished Engineer (Management) @ (April 2024 - February 2025)
- Director @ (September 2021 - March 2024)
- Senior Manager @ (September 2019 - August 2021)
- Technologist @ (June 2018 - August 2019)
- Senior Project Manager @ Corning Incorporated (January 2018 - May 2018)
- Assistant Professor @ (September 2011 - December 2017)
- Associate Professor @ (June 2009 - July 2011)
- Assistant Professor @ (August 2003 - May 2009)
Bo Yang Education
- University of Houston
M.S. (96) & Ph.D. (98) (Mechanical Engineering)
1994-1998 - University of Science and Technology of China
B.S. (92) (Mechanical Engineering)
1987-1994
Bo Yang Skills
- ANSYS
- CFD
- Cross-functional Team Leadership
- Design of Experiments (DOE)
- Engineering Management
- Failure Analysis
- Fatigue Analysis
- Finite Element Analysis
- Fracture Mechanics
- Materials Characterization
- Mechanical Behavior of Materials
- Mechanics of Materials
- Modeling and Simulation
- Packaging Engineering
- Product Development
- Reliability Engineering
- Research and Development (R&D)
- Semiconductors
- Structural Analysis
- Vibration Analysis
- University Teaching
- Teaching
- Academic Advising
- Qualitative Research
Bo Yang Summary
- Bo Yang, based in Milpitas, CA, US, is currently a Distinguished Engineer (Management) at Sandisk. Bo Yang brings experience from previous roles at SLAC/Stanford University and Western Digital. Bo Yang holds a 1994 - 1998 M.S. (96) & Ph.D. (98) in Mechanical Engineering @ University of Houston. With a robust skill set that includes ANSYS, CFD, Cross-functional Team Leadership, Design of Experiments (DOE), Engineering Management and more. Bo Yang has 1 emails on RocketReach.
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