2023 -now Member of Technical Staff --DEG Design Methodology and Reliability Verification @
2018 -now Principal Engineer @
2012 -2018 Senior Designer @
2001 -2011 Designer @
1997 -2001 Product Engineer @
Ben Education
University of Idaho
Master (EE)
1995-1997
Wuhan University of Technology
Master (ME)
Ben Skills
CMOS
Integrated Circuit Design
Mixed Signal
IC
Semiconductors
Silicon
Low-power Design
Debugging
Failure Analysis
Analog
Logic Design
Verilog
ASIC
Testing
Semiconductor Industry
Dynamic Random-Access Memory (DRAM)
Electronics
System on a Chip (SoC)
EDA
Integrated Circuits (IC)
Integrated Circuits Ic
Dynamic Random Access Memory Dram
Low Power Design
System On A Chip Soc
Dynamic Random Access Memory
Integrated Circuits
System on a Chip
Ben Summary
Ben, based in Boise, ID, US, is currently a Principal Engineer at Micron Technology. Ben brings experience from previous roles at Micron Technology. Ben holds a 1995 - 1997 Master in EE @ University of Idaho. With a robust skill set that includes CMOS, Integrated Circuit Design, Mixed Signal, IC, Semiconductors and more. Ben has 2 emails and 1 mobile phone numbers on RocketReach.
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