Zhi Yang's Location
New York, NY, US
Zhi Yang's Work
- Sr Director of Packaging Engineering @ Groq
- Associate Editor @ Journal of Microelectronics and Electronic Packaging
- Chip Package Technologist @ Google
- Thermal and Packaging Lead @ GlobalFoundries
- Graduate Research Assistant @ University of Maryland
- Graduate Teaching Assistant @ University of Maryland
Zhi Yang's Education
- University of Maryland College Park
Zhi Yang's Skills
- Physics
- Hands on Machining
- AutoCAD
- Gradient Coil Static Magnetic Field
- Numerical Simulation
- Numerical Analysis
- Matlab
- Data Analysis
- Laser Ir Camera Expertise
- Heat Transfer
Zhi Yang's Summary
Zhi Yang, based in New York, NY, US, is currently a Sr Director of Packaging Engineering at Groq, bringing experience from previous roles at Journal of Microelectronics and Electronic Packaging, Google, GLOBALFOUNDRIES and University of Maryland College Park. Zhi Yang holds a University of Maryland College Park. With a robust skill set that includes Physics, Hands on Machining, AutoCAD, Gradient Coil Static Magnetic Field, Numerical Simulation and more, Zhi Yang contributes valuable insights to the industry. Zhi Yang has 3 emails on RocketReach.
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