Yang Jun-Jie's Location
Tainan, Tainan City, TW
Yang Jun-Jie's Work
- Advance package integration Engineer @ TSMC
- LT RD engineer @ Winbond
- LT RD engineer @ United Microelectronics Corporation (UMC)
Yang Jun-Jie's Education
- National Cheng Kung University
碩士 (Materials Science)
2013 - 2015 - 國立成功大學
學士 (Materials Science)
2009 - 2013
Yang Jun-Jie's Skills
- Microsoft Office
- Microsoft PowerPoint
- Microsoft Excel
- Dbo
- Microsoft Word
- Research
- Engineering
- Cdsem
Yang Jun-Jie's Summary
Yang Jun-Jie, based in Tainan, Tainan City, TW, is currently a Advance package integration Engineer at 台積電, bringing experience from previous roles at 華邦電子 and 聯華電子股份有限公司. Yang Jun-Jie holds a 2013 - 2015 碩士 in Materials Science @ National Cheng Kung University. With a robust skill set that includes Microsoft Office, Microsoft PowerPoint, Microsoft Excel, Dbo, Microsoft Word and more, Yang Jun-Jie contributes valuable insights to the industry. Yang Jun-Jie has 1 email on RocketReach.
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