Jun He Location
Taiwan
Jun He Work
Jun He Education
Jun He Skills
Jun He Summary
Jun He, based in Taiwan, is currently a Vice President of Advanced Packaging Technology and Service and Corporate Quality and Reliability at TSMC. Jun He brings experience from previous roles at TSMC and Intel Corporation. Jun He holds a UC Santa Barbara. With a robust skill set that includes Supply Chain Optimization, Quality culture, Transformational Leadership, Cross-functional Team Leadership, Leadership Development and more. Jun He has 2 emails on RocketReach.