Jun He Email & Phone Number

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Vice President of Advanced Packaging Technology and Service and Corporate Quality and Reliability @ (September 2022 - Present)
Vice President of Corporate Quality and Reliability @ (November 2020 - September 2022)
Head of Corporate Quality and Reliability @ (March 2019 - November 2020)
Senior Director of Corporate Quality and Reliability @ (May 2017 - March 2019)
Senior Director @ (April 2012 - May 2017)
Director @ (October 2010 - April 2012)
Engineering Manager @ (June 2000 - October 2010)
Member of Technical Staff @ (December 1996 - June 2000)

Jun He, based in Taiwan, is currently a Vice President of Advanced Packaging Technology and Service and Corporate Quality and Reliability at TSMC. Jun He brings experience from previous roles at TSMC and Intel Corporation. Jun He holds a Doctor of Philosophy (Ph.D.) in Material Science @ UC Santa Barbara. With a robust skill set that includes Supply Chain Optimization, Quality culture, Transformational Leadership, Cross-functional Team Leadership, Leadership Development and more. Jun He has 2 emails on RocketReach.