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Jun He Location
Taiwan
Jun He Work
2022 -now Vice President of Advanced Packaging Technology and Service and Corporate Quality and Reliability @
2020 -2022 Vice President of Corporate Quality and Reliability @
2019 -2020 Head of Corporate Quality and Reliability @
2012 -2017 Senior Director @
2010 -2012 Director @
2000 -2010 Engineering Manager @
1996 -2000 Member of Technical Staff @
Jun He Education
UC Santa Barbara
Jun He Skills
Supply Chain Optimization
Quality culture
Transformational Leadership
Cross-functional Team Leadership
Leadership Development
Strategic Leadership
Research and Development (R&D)
Reliability Engineering
International Organizations
Manufacturing Operations Management
Manufacturing
Semiconductors
Embedded Systems
Testing
Electronics
Project Management
Product Development
C
C++
Intel
Jun He Summary
Jun He, based in Taiwan, is currently a Vice President of Advanced Packaging Technology and Service and Corporate Quality and Reliability at TSMC. Jun He brings experience from previous roles at TSMC and Intel Corporation. Jun He holds a UC Santa Barbara. With a robust skill set that includes Supply Chain Optimization, Quality culture, Transformational Leadership, Cross-functional Team Leadership, Leadership Development and more. Jun He has 2 emails on RocketReach.
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