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Yanfeng Chen Location
Cupertino, CA, US
Yanfeng Chen Work
2021 -now IC Packaging Engineering Manager @
2012 -2021 Packaging Engineer and Senior Packaging Engineer @
2010 -2012 Staff Engineer, Process Development @
2007 -2010 Senior Principal Engineer @
2006 -2007 Senior Thin Film Engineer @
2005 -2006 Senior Process Engineer @
Yanfeng Chen Education
Northwestern University
Ph.D. (Materials Science and Engineering)
2001-2005
Peking University
M.S. (Chemistry)
1998-2001
Jilin University
B.S. (Chemistry)
1994-1998
Yanfeng Chen Skills
Materials Science
Engineering
Yanfeng Chen Summary
Yanfeng Chen, based in Cupertino, CA, US, is currently a IC Packaging Engineering Manager at Apple. Yanfeng Chen brings experience from previous roles at Apple, Western Digital and Intematix. Yanfeng Chen holds a 2001 - 2005 Ph.D. in Materials Science and Engineering @ Northwestern University. With a robust skill set that includes Materials Science, Engineering and more. Yanfeng Chen has 2 emails and 2 mobile phone numbers on RocketReach.
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