2009 -
2014 Principal Engineer, Platform Architect of Sensing solution @
2008 -
2009 Manager of Application Engineering @
2000 -
2008 Principal System Engineer @
1999 -
1999 Intern @
Xianfeng Ding Education
Arizona State University
Training (Circuit Design)
2004
-
2004
Chinese Academy of scinece
Ph.D (Artificial Intelligence)
1997
-
2000
Harbin Engineering University
BS,MS (Electrical and Electronics Engineering)
1990
-
1996
Xianfeng Ding Skills
SoC
IC
Firmware
FPGA
MEMS
Mixed Signal
Analog
Simulations
RTOS
Electronics
Verilog
C
System Architecture
Circuit Design
Signal Processing
Microelectronics
Semiconductors
Analog Circuit Design
Integration
Programming
Processors
TCL
Engineering Management
R&D
Wireless
Hardware Architecture
Debugging
Semiconductor Industry
VHDL
Systems Engineering
Testing
Embedded Systems
Labview
RF
Failure Analysis
PCB design
Microcontrollers
EDA
Perl
CMOS
Hardware
Thin Films
RTL design
Microprocessors
Silicon
Consumer Electronics
Algorithms
USB
Physics
Power Management
Physical Design
Microsoft Office
Design
Management
Xianfeng Ding Summary
Xianfeng Ding, based in Zhejiang, China, is currently a General Manager at MING-II Robotics. Xianfeng Ding brings experience from previous roles at Vanke, Alibaba Cloud, Huawei Technologies and Intel Corporation. Xianfeng Ding holds a 2004 - 2004 Training in Circuit Design @ Arizona State University. With a robust skill set that includes SoC, IC, Firmware, FPGA, MEMS and more. Xianfeng Ding has 3 emails on RocketReach.
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