William Capen Email & Phone Number
Chairperson @ IPC-Association Connecting Electronics Industries
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William Capen Location
- Johnstown, Pennsylvania, United States
William Capen Work
- Chairperson @ (June 2022 - Present)
- Engineering Technical Specialist @ (August 2018 - Present)
- Midwest Engineering Sales @ (May 2018 - August 2018)
- Senior Manufacturing Engineer Iii @ (August 2015 - May 2018)
- PCB Assembly Engineer @ (July 2015 - August 2015)
- MFG Engineer Ii @ (December 2013 - August 2015)
- MFG Engineer @ (April 2011 - December 2013)
- SMT Process Engineer @ (October 2010 - March 2011)
- Senior Manufacturing Engineering Technian @ (April 2008 - September 2010)
- Factory Supervisor and Technician @ (January 2006 - February 2008)
- Equipmnt Tech @ (January 1995 - January 2001)
William Capen Education
- University of Wisconsin-Stout
Master's degree ( Manufacturing Engineering)
2012-2015 - University of Wisconsin-Stout
Industrial Management
1999-2008 - Fox Valley Technical College
Assoicates ( Electronics Technolgy)
1989-1991
William Capen Skills
- IPC 7711/7721 Rework, Modification, and Repair of Electronic Assemblies Trainer.
- Electronics Manufacturing Professional
- IPC-J-STD-001 CIT
- SMT
- Lean Manufacturing
- Team Management
- Process Engineering
- SPC
- Value Stream Mapping
- Electronics
- Design for Manufacturing
- Electronics Manufacturing
- FMEA
- MRP
- Troubleshooting
- Manufacturing Engineering
- Manufacturing
- 5S
- Manufacturing Operations Management
- Six Sigma
- Assembly Lines
- Root Cause Analysis
- DMAIC
- Design of Experiments
- Electricians
- Engineering Management
- Supply Chain Management
- Continuous Improvement
- Kaizen
- Quality Management
- Engineering
- Failure Mode and Effects Analysis (FMEA)
- Statistical Process Control (SPC)
- Statistical Process Control
- Failure Mode and Effects Analysis
- Ipc J Std 001 Cit
William Capen Summary
- William Capen, based in Johnstown, Pennsylvania, United States, is currently a Chairperson at Ipc-Association Connecting Electronics Industries. William Capen brings experience from previous roles at Honeywell, Semipack Services Inc., DRS Technologies, Inc. and Saic. William Capen holds a 2012 - 2015 Master's degree in Manufacturing Engineering @ University of Wisconsin-Stout. With a robust skill set that includes IPC 7711/7721 Rework, Modification, and Repair of Electronic Assemblies Trainer., Electronics Manufacturing Professional, IPC-J-STD-001 CIT, SMT, Lean Manufacturing and more. William Capen has 2 emails and 2 mobile phone numbers on RocketReach.
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