2020 -
2021 Director of Technology at Summit Interconnect @
2012 -
2021 Director of Engineering @
2017 -
2020 Director Of Engineering @
2016 -
2020 Senior Field Application Engineer @
1997 -
2012 Engineering Manager @ MEI (Marcel Electronics International)
1986 -
1993 Application Engineer @
Gerry Partida Skills
Design for Manufacturing
Electronics
PCB design
Manufacturing
RF
Circuit Design
Electronics Manufacturing
Signal Integrity
SMT
UL
Analog
IPC Member
Genesis 2000
IPC-6012
IPC-6018
IPC-A-600
PCQR2
Cross-functional Team Leadership
IPC-1601
HDI High Density Interconnect
PCB Fabrication
AS9100
AS9102
Engineering Management
Failure Analysis
Lean Manufacturing
Product Development
Ipc a 600
Microsoft Office
Software Development
Ipc 6012
High Density Interconnect
Ipc 6018
Certified Ipc Trainer Ipc a 600
Ipc 1601
Engineering
Microsoft Word
Cross Functional Team Leadership
Hdi
Hdi High Density Interconnect
Gerry Partida Summary
Gerry Partida, based in Irvine, CA, US, is currently a Co-Chair IPC-6012 at IPC. Gerry Partida brings experience from previous roles at Summit Interconnect. With a robust skill set that includes Design for Manufacturing, Electronics, PCB design, Manufacturing, RF and more. Gerry Partida has 4 emails and 1 mobile phone numbers on RocketReach.
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