2023 -2025 High Voltage Electrical Interconnect Engineer @
2022 -2023 Sr. Product Design Engineer @
2021 -2022 Lead Engineer @
2019 -2021 Principle Engineer @
2018 -2019 Sr. FAE and Technical Marketing @
2017 -2019 Sr. Project Engineer @
2003 -2017 Sr. Project Engineer @
1996 -2003 Product Design Manager @
Vincent Lin Education
Tamkang University 1992-1995
Vincent Lin Skills
Electronics
Manufacturing
Product Development
Design for Manufacturing
Connectors
Product Management
Materials
Automotive
Finite Element Analysis
Hypermesh
Project Management
SPC
FMEA
Tolerance Analysis
Injection Molding
Components
Engineering Management
Product Design
DFMEA
Lean Manufacturing
Design of Experiments
Cross-functional Team Leadership
Development
Global Health
Economics
Solutions
Oncology
Connectivity Solutions
Cross Functional Team Leadership
Design
Vincent Lin Summary
Vincent Lin, based in Auburn Hills, MI, US, is currently a Principal Engineer at Foxconn Interconnect Technology (FIT). Vincent Lin brings experience from previous roles at ARaymond Network, AirBorn Inc. and Amphenol FCi. Vincent Lin holds a 1992 - 1995 Tamkang University. With a robust skill set that includes Electronics, Manufacturing, Product Development, Design for Manufacturing, Connectors and more. Vincent Lin has 1 emails and 1 mobile phone numbers on RocketReach.
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