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Vincent Lin Location
Auburn Hills, MI, US
Vincent Lin Work
Principal Engineer @ (January 2025 - Present)
HV Electrical Interconnect Engineer @ (January 2023 - January 2025)
High Voltage Electrical Interconnect Engineer @ (January 2023 - January 2025)
Sr. Product Design Engineer @ (November 2022 - January 2023)
Lead Engineer @ (September 2021 - November 2022)
Principle Engineer @ (July 2019 - September 2021)
Sr. FAE and Technical Marketing @ (May 2018 - July 2019)
Sr. Project Engineer @ (April 2017 - July 2019)
Sr. Project Engineer @ (March 2003 - April 2017)
Product Design Manager @ (October 1996 - March 2003)
Vincent Lin Education
Tamkang University 1992-1995
Vincent Lin Skills
Electronics
Manufacturing
Product Development
Design for Manufacturing
Connectors
Product Management
Materials
Automotive
Finite Element Analysis
Hypermesh
Project Management
SPC
FMEA
Tolerance Analysis
Injection Molding
Components
Engineering Management
Product Design
DFMEA
Lean Manufacturing
Design of Experiments
Cross-functional Team Leadership
Development
Global Health
Economics
Solutions
Oncology
Connectivity Solutions
Cross Functional Team Leadership
Design
Vincent Lin Summary
Vincent Lin, based in Auburn Hills, MI, US, is currently a Principal Engineer at Foxconn Interconnect Technology (FIT). Vincent Lin brings experience from previous roles at ARaymond Network, AirBorn Inc. and Amphenol FCi. Vincent Lin holds a 1992 - 1995 Tamkang University. With a robust skill set that includes Electronics, Manufacturing, Product Development, Design for Manufacturing, Connectors and more. Vincent Lin has 1 emails and 1 mobile phone numbers on RocketReach.
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