2025 -now Senior Principal: Lead System Architect Engineer @
2024 -2025 Principal System Architect Engineer @
2022 -2024 Lead Field Application Engineer @
2021 -2021 Senior Signal Integrity Engineer and Lead Field Application Engineer @
2018 -2021 Senior Field Application Engineer @
2016 -2017 Senior Signal Integrity Engineer @
2011 -2015 Signal Integrity Engineer @
2011 -2011 System Engineer (Contractor) @
2008 -2011 EMI and EMC Engineer @
2006 -2008 Electromagnetic Application Engineer @
2002 -2006 Signal Integrity Engineer @
2001 -2002 Sigal Integrity Engineer @
1998 -2000 Research Asistant @
1997 -1998 Teaching Assistant @
Timothy Pak Education
Missouri University of Science and Technology
Master’s Degree (Electromagnetism)
1997-2000
Missouri University of Science and Technology
Bachelor’s Degree (Electrical Engineering)
1993-1997
Illinois Institute of Technology
(Electrical and Electronics Engineering)
Timothy Pak Skills
Signal Integrity
PCB design
Simulations
Network Analyzer
Radio Frequency (RF)
Oscilloscope
RF Engineering
Customer Service
Software Development
Microsoft Word
Aerospace
Management
Project Management
Radio Frequency Rf
Radio Frequency
Timothy Pak Summary
Timothy Pak, based in Round Rock, TX, US, is currently a New Business Development at Foxconn Interconnect Technology (FIT). Timothy Pak brings experience from previous roles at Foxconn Interconnect Technology (FIT), Amphenol TCS and Volex. Timothy Pak holds a 1997 - 2000 Master’s Degree in Electromagnetism @ Missouri University of Science and Technology. With a robust skill set that includes Signal Integrity, PCB design, Simulations, Network Analyzer, Radio Frequency (RF) and more. Timothy Pak has 3 emails and 3 mobile phone numbers on RocketReach.
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