2017 -2018 Technical Project Manager - Package and Assembly @
2014 -2016 Sr. Package and Assembly Development Engineer @
2010 -2014 Sr. Package and Process Development Engineer @
2007 -2010 Wire Bond Process Engineer @
2006 -2007 Manufacturing Process Engineer - Wire Bond and Die Attach @
2005 -2006 Outgoing Quality Engineer @
2004 -2005 Cadet Process Engineer @
Tyrone Plata Education
Mapua Institute of Technology
Bachelor of Science (Communications, Engineering, Electronics)
1998-2003
University of Perpetual Help System DALTA 1988-1998
Tyrone Plata Summary
Tyrone Plata, based in Nijmegen, GE, NL, is currently a Staff Hardware Engineer - Advanced Packaging at Qualcomm. Tyrone Plata brings experience from previous roles at Qualcomm, NXP Semiconductors and MAScIR - Moroccan Foundation for Advanced Science, Innovation and Research. Tyrone Plata holds a 1998 - 2003 Bachelor of Science in Communications, Engineering, Electronics @ Mapua Institute of Technology. Tyrone Plata has 3 emails on RocketReach.
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