Tyrone Plata Email
Staff Hardware Engineer - Advanced Packaging @ Qualcomm
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Tyrone Plata Location
- Nijmegen, GE, NL
Tyrone Plata Work
- Staff Hardware Engineer - Advanced Packaging @ (November 2021 - Present)
- Senior Hardware Engineer - Advanced Packaging @ (May 2018 - November 2021)
- Technical Project Manager - Package and Assembly @ (January 2017 - April 2018)
- Sr. Package and Assembly Development Engineer @ (January 2014 - December 2016)
- Sr. Package and Process Development Engineer @ (January 2010 - January 2014)
- Wire Bond Process Engineer @ (July 2007 - January 2010)
- Manufacturing Process Engineer - Wire Bond and Die Attach @ (July 2006 - July 2007)
- Outgoing Quality Engineer @ (June 2005 - July 2006)
- Cadet Process Engineer @ (February 2004 - May 2005)
Tyrone Plata Education
- Mapua Institute of Technology
Bachelor of Science (Communications, Engineering, Electronics)
1998-2003 - University of Perpetual Help System DALTA 1988-1998
Tyrone Plata Summary
- Tyrone Plata, based in Nijmegen, GE, NL, is currently a Staff Hardware Engineer - Advanced Packaging at Qualcomm. Tyrone Plata brings experience from previous roles at Qualcomm, NXP Semiconductors and MAScIR - Moroccan Foundation for Advanced Science, Innovation and Research. Tyrone Plata holds a 1998 - 2003 Bachelor of Science in Communications, Engineering, Electronics @ Mapua Institute of Technology. Tyrone Plata has 3 emails on RocketReach.
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Tyrone Plata
Staff Hardware Engineer - Advanced Packaging
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