Tuck Woo Email & Phone Number
Senior Engineer 高级工程师 - Mechanical and Packaging Design in Products Design 产品机械与包装设计 @ Allied Telesis
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Tuck Woo Location
- Singapore
Tuck Woo Work
- 1999 -now Senior Engineer 高级工程师 - Mechanical and Packaging Design in Products Design 产品机械与包装设计 @
Tuck Woo Education
- The University of Wales, Aberystwyth 威尔士阿伯斯威大学
Master 硕士 (Computer Science 电脑科学)
Tuck Woo Skills
- ARM
- Embedded Software
- Embedded Systems
- Debugging
- Linux
- Device Drivers
- C
- Software Engineering
- Testing
- Mechanical Engineering
- Software Development
- C++
- TCP/IP
- Telecommunications
- Python
- Integration
- Packaging
- Design
Tuck Woo Summary
- Tuck Woo, based in Singapore, is currently a Senior Engineer 高级工程师 - Mechanical and Packaging Design in Products Design 产品机械与包装设计 at Allied Telesis. Tuck Woo holds a Master 硕士 in Computer Science 电脑科学 @ The University of Wales, Aberystwyth 威尔士阿伯斯威大学. With a robust skill set that includes ARM, Embedded Software, Embedded Systems, Debugging, Linux and more. Tuck Woo has 3 emails on RocketReach.
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