Sr. Principal Packaging Engineer @ (January 2021 - July 2024)
Mechanical Engineering Manager @ (April 2019 - January 2021)
Lead Mechanical Engineer @ (July 2013 - April 2019)
Packaging and Testing Manager @ (December 2011 - July 2013)
Mechanical Engineer @ (August 2010 - December 2011)
Mechanical Engineer Intern @ (July 2008 - November 2008)
Tim Smith Education
Stevens Institute of Technology
Master of Engineering (MEng) (Engineering/Industrial Management)
2006-2010
Stevens Institute of Technology
Bachelor of Engineering (BEng) (Mechanical Engineering)
2006-2010
Tim Smith Summary
Tim Smith, based in Chapel Hill, NC, US, is currently a Product Manager - Packages at Nuvotronics. Tim Smith brings experience from previous roles at Cubic Mission & Performance Solutions, Cubic Corporation and Nuvotronics. Tim Smith holds a 2006 - 2010 Master of Engineering (MEng) in Engineering/Industrial Management @ Stevens Institute of Technology. Tim Smith has 1 emails and 2 mobile phone numbers on RocketReach.
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