Tektronix Component Solutions Information

Tektronix Component Solutions: Your US-Based, Outsourced Assembly and Test (OSAT) Partner Founded in 1970, Tektronix Component Solutions is a strategic partner in the microelectronics sector, offering comprehensive Outsourced Semiconductor Assembly and Test (OSAT) services. As a subsidiary of Tektronix, we provide turn-key design, assembly, and testing services for low-volume, high-reliability applications. Based in Beaverton, Oregon, our advanced production facilities and dedicated team ensure excellence in customer support. We serve aerospace, defense, medical, and commercial markets, emphasizing strategic partnerships and delivering on reliability and integrity. Our broad suite of IC packaging solutions includes over-molded packages, wire-bonded hermetic packages, Chip on flex, Flip-Chip BGAs (FC BGA), and Wire-bond BGAs (WB BGA). Our design services leverage advanced tools and methodologies for full material characterization and predictive failure simulations. Quality is at our core, demonstrated through strategic sourcing and internal capabilities for reliability assurance and failure analysis, maintaining compliance with AS9100 and ISO9001 standards. As industry leaders, we continuously innovate packaging formats to include next-generation solutions like 2.5D packaging. Our state-of-the-art testing services support digital, analog, and mixed-signal components, showcasing our leadership in technology innovation, reflecting Tektronix's pioneering spirit. Explore our website and connect with us to discover how Tektronix Component Solutions can be your technology innovator and trusted manufacturing partner in IC package and test solutions.