Tejas Shetty Email & Phone Number
Staff Engineer Package Reliability @ Micron Technology
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Tejas Shetty Location
- Boise, ID, US
Tejas Shetty Work
- 2019 -now Staff Engineer Package Reliability @
- 2018 -2019 Product Quality and Reliability Engineer @
- 2016 -2018 Product Quality and Reliability Engineer @
- 2015 -2016 Product Integration Engineer - APRD @
- 2013 -2014 Graduate Research Assistant @ Electronics MEMS and Nanoelectronics Systems Packaging Center (EMNSPC)
- 2013 -2014 Intramural Sports Referee @
- 2010 -2012 Design Engineer (Engineering-Mechanical) @ FLSmidth Pfister India Ltd
Tejas Shetty Education
- The University of Texas at Arlington 2012-2014
- University of Mumbai 2006-2010
Tejas Shetty Skills
- ANSYS
- Finite Element Analysis
- Electronics Packaging
- Mechanical Engineering
- Semiconductor Failure Analysis
- Reliability Engineering
- Tensile Testing
- Simulations
- Design of Experiments
- MEMS
- Engineering Design
- Thermal Analysis
- Molecular Dynamics
- Fatigue Analysis
- AutoCAD
- Matlab
- Engineering
- Pro Engineer
- Solid Edge
- CAD
- GD&T
- Heat Transfer
- CFD
- CAE
- SolidWorks
- PTC Creo
- FMEA
- Geometric Dimensioning & Tolerancing
- Computer-Aided Design (CAD)
- Vendors
- Semiconductor Packaging
- Assemblies
- Geometric Dimensioning And Tolerancing
- Structure
- Thesis
- Failure
- Labview
- Literature
- Design Analysis
- Passivation
- Assessment
- Conductivity
- Recreation
- Texas
- Die
- Design
- Computational
- Science
- Icepak
- Cycling
- Modes
- Death
- Silicon
- Soccer
- Publications
- Methodology
- Reliability
- Metals
- System
- Validation
- Quality And Reliability
- Element
- Microsoft Office
- Variable
- Testing
- Calculations
- Orlando
- Mumbai
- Assembly
- Thermal
- Research
- CPI
- Thermal Management
- Flip Chip
- Reliability Statistics
- Drawing
- Molecular
- Analysis
- Dic
- Instron
- R
- Power
- Feeders
- Mechanical
- Gad
- Fracture
- Modeling
- Efficacy
- ERP
- Dfr
- Cost Savings
- Nano
- Characterization
- Physics Of Failure
- Semiconductor Failure
- Allegro
- Molding
- Social Influence
- Digital Image Correlation
- Bill of Materials
- ASTM
- Plants
- Computer Aided Design Cad
- Board Level
- Usa
- Packaging
- Bulk Material Handling
- PCB design
- Electronics
- San Francisco
- Attachment
- India
- Design Tools
- SMT
- Optimization
- Abstraction
- Chip
- Computer Aided Design
Tejas Shetty Summary
- Tejas Shetty, based in Boise, ID, US, is currently a Staff Engineer Package Reliability at Micron Technology. Tejas Shetty brings experience from previous roles at Micron Technology and Electronics MEMS and Nanoelectronics Systems Packaging Center (EMNSPC). Tejas Shetty holds a 2012 - 2014 The University of Texas at Arlington. With a robust skill set that includes ANSYS, Finite Element Analysis, Electronics Packaging, Mechanical Engineering, Semiconductor Failure Analysis and more. Tejas Shetty has 4 emails on RocketReach.
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