Ted Tessier Email & Phone Number
Founder | Chief Technologist | Sr. 3D Advanced IC Packaging Expert
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Ted Tessier Location
- Phoenix, AZ, US
Ted Tessier Work
- Founder | Chief Technologist | Sr. 3D Advanced IC Packaging Expert @ Gordian Semiconductor Packaging Solutions LLC (August 2025 - Present)
- Advanced Packaging Research Business Development Executive @ IBM Semiconductors | (February 2024 - June 2025)
- Chief Technology Officer - Advanced Packaging Technologies @ (November 2022 - February 2024)
- Founder | Chief Technologist @ Gordian Semiconductor Packaging Solutions LLC (August 2017 - November 2022)
- Senior Technical Advisor | Electronic Packaging @ Fujikura America Inc. (October 2016 - August 2017)
- Chief Technical Officer | Semiconductor Packaging Management @ Huatian Technology - FlipChip International (April 2015 - July 2016)
- Chief Technical Officer | Semiconductor Packaging Management @ (January 2006 - March 2015)
- Senior Director | Wafer Level Packaging Technologies @ (January 2002 - January 2006)
- VP | Emerging Packaging Technologies @ (January 2000 - January 2002)
- VP | Advanced Technology @ (January 1998 - January 2000)
Ted Tessier Education
- University of Ottawa
Master of Science (MS) (Applied Polymer Chemistry)
1981-1984 - Laurentian University/Université Laurentienne
Bachelor of Science (B.S.) (Biochemistry)
1977-1981
Ted Tessier Skills
- Advanced Packaging Technology Development
- Technology Roadmapping & Realization
- Advanced Packaging Business Development
- Domestic and Overseas OSAT Managemement
- Semiconductor Industry
- Electronics
- Engineering Management
- Manufacturing
- Packaging
- Microelectronics
- Semiconductors
- IC
- Design of Experiments
- Program Management
- FMEA
- Optics
- Failure Analysis
- Lean Manufacturing
- PCB design
- Metrology
- R&D
- Silicon
- Six Sigma
- Characterization
- Product Engineering
- SPC
- Mixed Signal
- Process Engineering
- Product Development
- Engineering
- Sensors
- RF
- Materials Science
- Continuous Improvement
- MEMS
- Product Marketing
- Reliability
- Testing
- CMOS
- Thin Films
- Cross-functional Team Leadership
- Product Management
- Analog
- Simulations
- Process Simulation
- Leadership
- Start-ups
- Statistical Process Control (SPC)
- Research and Development (R&D)
- Semiconductor Electronic Packaging Management
- Semiconductor Electronic Packaging
- Semiconductor Management
- Semiconductor Packaging
- 3D-IC Packaging / Heterogeneous Integration
- Technology Business Development
Ted Tessier Summary
- Ted Tessier, based in Phoenix, AZ, US, is currently a Founder | Chief Technologist | Sr. 3D Advanced IC Packaging Expert at Gordian Semiconductor Packaging Solutions LLC. Ted Tessier brings experience from previous roles at IBM Semiconductors |, Integra Technologies Inc., Gordian Semiconductor Packaging Solutions LLC and Fujikura America Inc.. Ted Tessier holds a 1981 - 1984 Master of Science (MS) in Applied Polymer Chemistry @ University of Ottawa. With a robust skill set that includes Advanced Packaging Technology Development, Technology Roadmapping & Realization, Advanced Packaging Business Development, Domestic and Overseas OSAT Managemement, Semiconductor Industry and more. Ted Tessier has 1 emails and 1 mobile phone numbers on RocketReach.
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