FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China
View Top Employees from FlipChip InternationalWebsite | http://www.flipchip.com |
Revenue | $27.9 million |
Employees | 78 (70 on RocketReach) |
Founded | 2004 |
Address | 3701 E University, Phoenix, Arizona 85034, US |
Phone | (602) 431-6020 |
Technologies |
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Industry | Semiconductor Manufacturing, Consumer Services General, Computer, Semiconductor Wafer Solder Bumping (WLCSP), Consumer Services, Consumer Electronics, Multi Project Wafers, Hardware, Semiconductor Assembly and Test, Information Technology, Backgrind, Wafer Saw, Tape and Reel, Laser Mark, Web Design, Design |
Web Rank | 14 Million |
Keywords | Flipchip International, Wafer Sawing "Fragile" |
Competitors | Aptar CSP Technologies, OIA, Oliver Healthcare Packaging, Outlook Group LLC, Scholle Europe France SAS |
SIC | SIC Code 367 Companies, SIC Code 36 Companies |
NAICS | NAICS Code 33 Companies, NAICS Code 334 Companies |
Looking for a particular FlipChip International employee's phone or email?
The FlipChip International annual revenue was $27.9 million in 2024.
70 people are employed at FlipChip International.
FlipChip International is based in Phoenix, Arizona.
The NAICS codes for FlipChip International are [33, 334].
The SIC codes for FlipChip International are [367, 36].