2011 -
2017 Senior Director Of Engineering Team of FCCSP, FCBGA, SCSP, SIP and Bump @
2007 -
2011 Diector for Sawn and Inframe QFN Package Development Engineering @
2005 -
2007 Senior Manager for Package Engineering of CABGA, SCSP, QFN @
1993 -
2005 Process Engineering Junior and Senior and Manager for L and F package @
Sunghan Ryu Education
한양대학교
Master's degree (Advanced New Material Science Engineering)
2000
-
2003
성균관대학교
Bachelor of Science (BS) (Metal/Material Engineering)
1987
-
1993
null 2018null
Sunghan Ryu Skills
Assembly Package Engineering
Program Management
Public Speaking
Java
Sunghan Ryu Summary
Sunghan Ryu, based in Taiwan, is currently a VP Operation head for WLCSP DPS at Amkor Technology, Inc.. Sunghan Ryu brings experience from previous roles at Amkor Technology, Inc.. Sunghan Ryu holds a 2000 - 2003 Master's degree in Advanced New Material Science Engineering @ 한양대학교. With a robust skill set that includes Assembly Package Engineering, Program Management, Public Speaking, Java and more. Sunghan Ryu has 2 emails on RocketReach.
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