Smith Lim Location
- Gyeonggi-do, South Korea
Smith Lim Work
- 2024 - now Director (기술이사) @
- 2024 - 2024 IC Package Design Team Leader @
- 2022 - 2024 Principal IC Package design engineer @
- 2015 - 2022 Principal IC Package design engineer @
- 2008 - 2014 Sr. Staff. IC Package design engineer @
- 2004 - 2008 Sr. RF Package design engineer @ 자화전자주식회사
- 2002 - 2004 CDMA Hardware Engineer @ Codial tech
Smith Lim Summary
- Smith Lim, based in Gyeonggi-do, South Korea, is currently a Director (기술이사) at 코아시아세미(CoAsia SEMI). Smith Lim brings experience from previous roles at SIMMTECH, ChangXin Memory Technologies, Inc., SK 하이닉스 and ASE Group Global. Smith Lim has 1 emails on RocketReach.
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Smith Lim
Director (기술이사)
Gyeonggi-do, South Korea
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Smith Lim
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