Sean Devlin Email & Phone Number

Lead Packaging Design Engineer @ Chipletz

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Sean Devlin Location

Mesa, AZ, US

Sean Devlin Work

2021 - now Lead Packaging Design Engineer @ Chipletz
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2021 - 2022 Senior IC Packaging and PCB Layout Engineer @ Rockley Photonics Inc.
2018 - 2022 IC Packaging and PCB Layout Engineer @ Rockley Photonics Inc.

2014 - 2018 IC Packaging R and D Engineer @ Intel Corporation
2013 - 2016 Electronics Design Engineer @ Young Counsulting Services
2008 - 2011 Assistant Store Manager @ Sears

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Sean Devlin Education

George Mason University
Bachelor of Science - BS (Electrical and Electronics Engineering)
2009 - 2013
Westfield High School

Sean Devlin Skills

Mentor/Siemens EDA xPCB Layout
Cadence APD
OrCAD Capture CIS

Printed Circuit Board (PCB) Design
PCB design
Sales
CAD
Mathematics
Physics
Circuit Design

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Sean Devlin Summary

Sean Devlin, based in Mesa, AZ, US, is currently a Lead Packaging Design Engineer at Chipletz. Sean Devlin brings experience from previous roles at Rockley Photonics Inc., Intel Corporation and Young Counsulting Services. Sean Devlin holds a 2009 - 2013 Bachelor of Science - BS in Electrical and Electronics Engineering @ George Mason University. With a robust skill set that includes Mentor/Siemens EDA xPCB Layout, Cadence APD, OrCAD Capture CIS, Printed Circuit Board (PCB) Design, PCB design and more. Sean Devlin has 3 emails on RocketReach.

Sean Devlin Emails

Found 3 emails

Sean Devlin Phone Numbers

Found 2 phone numbers

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