Sean Devlin's Location
Mesa, AZ, US
Sean Devlin's Work
- Lead Packaging Design Engineer @ Chipletz
- Senior IC Packaging and PCB Layout Engineer @ Rockley Photonics
- IC Packaging and PCB Layout Engineer @ Rockley Photonics
- IC Packaging R and D Engineer @ Intel Corporation
- Electronics Design Engineer @ Young Counsulting Services
- Assistant Store Manager @ 1944
Sean Devlin's Education
- George Mason University
Bachelor of Science - BS (Electrical and Electronics Engineering)
2009 - 2013 - Westfield High School
Sean Devlin's Skills
- PCB design
- Python
- CAD
- Mathematics
- VHDL
- Analog Circuits
- Management
- Physics
- Electronics
- Circuit Design
Sean Devlin's Summary
Sean Devlin, based in Mesa, AZ, US, is currently a Lead Packaging Design Engineer at Chipletz, bringing experience from previous roles at Rockley Photonics Inc., Intel Corporation and Young Counsulting Services. Sean Devlin holds a 2009 - 2013 Bachelor of Science - BS in Electrical and Electronics Engineering @ George Mason University. With a robust skill set that includes PCB design, Python, CAD, Mathematics, VHDL and more, Sean Devlin contributes valuable insights to the industry. Sean Devlin has 2 emails on RocketReach.
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