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Sean Devlin Location
Mesa, AZ, US
Sean Devlin Work
Lead Packaging Design Engineer @ (September 2021 - Present)
Senior IC Packaging and PCB Layout Engineer @ Rockley Photonics Inc. (April 2021 - May 2022)
IC Packaging and PCB Layout Engineer @ Rockley Photonics Inc. (October 2018 - May 2022)
IC Packaging R and D Engineer @ (March 2014 - October 2018)
Electronics Design Engineer @ Young Counsulting Services (May 2013 - May 2016)
Assistant Store Manager @ (April 2008 - April 2011)
Sean Devlin Education
George Mason University
Bachelor of Science - BS (Electrical and Electronics Engineering)
2009-2013
Westfield High School
Sean Devlin Skills
Mentor/Siemens EDA xPCB Layout
Cadence APD
OrCAD Capture CIS
Printed Circuit Board (PCB) Design
PCB design
Sales
CAD
Mathematics
Physics
Circuit Design
Visual Basic for Applications (VBA)
VBScript
C
AutoCAD
Python
Autodesk Inventor
SOLIDWORKS
Team Leadership
Management
ANSYS HFSS
Schematic Capture
High Speed Design
Signal Integrity
Layout Tool Flow Management
Power Integrity
Eagle Scout
Bitbucket
Django
Git
Python (Programming Language)
Secure Shell (SSH)
Shell Scripting
Software Development
VHDL
Analog Circuits
Electronics
Matlab
Retail
Leadership
Cadence Schematic Capture
Microsoft Excel
Mentor Xpcb Layout
Rhinoceros
Mentor Graphics
Sean Devlin Summary
Sean Devlin, based in Mesa, AZ, US, is currently a Lead Packaging Design Engineer at Chipletz. Sean Devlin brings experience from previous roles at Rockley Photonics Inc., Intel Corporation and Young Counsulting Services. Sean Devlin holds a 2009 - 2013 Bachelor of Science - BS in Electrical and Electronics Engineering @ George Mason University. With a robust skill set that includes Mentor/Siemens EDA xPCB Layout, Cadence APD, OrCAD Capture CIS, Printed Circuit Board (PCB) Design, PCB design and more. Sean Devlin has 3 emails and 1 mobile phone numbers on RocketReach.
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