Steven Lee Location
Taiwan
Steven Lee Work
Steven Lee Education
Feng Chia University
Master's degree (Material science and engineering)
2002 - 2004
National Taiwan Ocean University
Bachelor's degree (Mechanical Engineering)
1991 - 1995
Steven Lee Skills
Steven Lee Summary
Steven Lee, based in Taiwan, is currently a VP of Packaging Engineering at Chipletz. Steven Lee brings experience from previous roles at Chipletz, AMD, VIA Technologies, Inc. and ASE Group - ASE (U.S.) INC.. Steven Lee holds a 2002 - 2004 Master's degree in Material science and engineering @ Feng Chia University. With a robust skill set that includes IC, Yield, Management, Cost Reduction, Project Management and more. Steven Lee has 3 emails on RocketReach.