Sr Substrate design engineer @ (January 1998 - June 2001)
Steven Lee Education
National Sun Yat-sen University
Master's degree (EMBA)
2024-2026
Feng Chia University
Master's degree (Material science and engineering)
2002-2004
National Taiwan Ocean University
Bachelor's degree (Mechanical Engineering)
1991-1995
Steven Lee Skills
3D Packaging
Advanced Product Quality Planning (APQP)
Bump
Cost Reduction
Cross-functional Team Leadership
Executive Management
Flip Chip assembly and 2.5D process
Flip Chip substrate
IC
Lean Six Sigma
Management
NPI Management
Packaging Engineering
Program Management
Project Management
Quality Management
Semiconductors
Six Sigma
Supplier Management
Team Leadership
Team Management
Value Engineering
Yield
Yield Management
advanced package development
Packaging
Cross Functional Team Leadership
Microsoft Excel
SQL
Graphic Design
Engineering
Steven Lee Summary
Steven Lee, based in Taiwan, is currently a VP of Packaging Engineering at Chipletz. Steven Lee brings experience from previous roles at AMD, VIA Technologies, Inc. and ASE Group - ASE (U.S.) INC.. Steven Lee holds a 2024 - 2026 Master's degree in EMBA @ National Sun Yat-sen University. With a robust skill set that includes 3D Packaging, Advanced Product Quality Planning (APQP), Bump, Cost Reduction, Cross-functional Team Leadership and more. Steven Lee has 2 emails on RocketReach.
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