Steven Lee Email

Steven Lee Email

VP of Packaging Engineering @ Chipletz

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Steven Lee Location

Taiwan

Steven Lee Work

Steven Lee Education

  • Feng Chia University

    Master's degree (Material science and engineering)

    2002 - 2004
  • National Taiwan Ocean University

    Bachelor's degree (Mechanical Engineering)

    1991 - 1995

Steven Lee Skills

  • IC
  • Yield
  • Management
  • Cost Reduction
  • Project Management
  • Semiconductors
  • Cross-functional Team Leadership
  • Program Management
  • Bump
  • Flip Chip assembly and 2.5D process

Steven Lee Summary

Steven Lee, based in Taiwan, is currently a VP of Packaging Engineering at Chipletz. Steven Lee brings experience from previous roles at Chipletz, AMD, VIA Technologies, Inc. and ASE Group - ASE (U.S.) INC.. Steven Lee holds a 2002 - 2004 Master's degree in Material science and engineering @ Feng Chia University. With a robust skill set that includes IC, Yield, Management, Cost Reduction, Project Management and more. Steven Lee has 3 emails on RocketReach.
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