Steven Lee Email

VP of Packaging Engineering @ Chipletz

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Steven Lee Location

Taiwan

Steven Lee Work

2025 - now VP of Packaging Engineering @ Chipletz
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2004 - 2025 Director, Packaging engineering _ External Manufacturing Operation @ AMD
2001 - 2004 Sr Package Engineer @ VIA Technologies, Inc.
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1998 - 2001 Sr Substrate design engineer @ 日月光封装测试（上海）有限公司
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Steven Lee Education

國立中山大學
Master's degree (EMBA)
2024 - 2026
Feng Chia University
Master's degree (Material science and engineering)
2002 - 2004
National Taiwan Ocean University
Bachelor's degree (Mechanical Engineering)
1991 - 1995

Steven Lee Skills

IC
Yield
Management

Cost Reduction
Project Management
Semiconductors
Cross-functional Team Leadership
Program Management
Bump
Flip Chip assembly and 2.5D process

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Steven Lee Summary

Steven Lee, based in Taiwan, is currently a VP of Packaging Engineering at Chipletz. Steven Lee brings experience from previous roles at AMD, VIA Technologies, Inc. and ASE Group - ASE (U.S.) INC.. Steven Lee holds a 2024 - 2026 Master's degree in EMBA @ 國立中山大學. With a robust skill set that includes IC, Yield, Management, Cost Reduction, Project Management and more. Steven Lee has 3 emails on RocketReach.

Steven Lee Emails

Found 3 emails

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Vancouver, BC, CA
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Steven Lee

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Chief Executive Officer and Co-founder at Chipletz

Spicewood, TX, US
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Michael Alfano

Co-Founder - Chief Architect and VP of Product at Chipletz

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Michael Su

Chief Technology Officer and Co-Founder at Chipletz

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Jeff Cain

VP of Engineering at Chipletz

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Steven Lee

VP of Packaging Engineering at Chipletz

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Gloria Lim

Procurement Lead at Chipletz

Austin, TX, US
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Scott Witcher

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Austin, TX, US
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Stephen Newberry

SI and PI Engineer at Chipletz

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Sean Devlin

Lead Packaging Design Engineer at Chipletz

Mesa, AZ, US
4
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Jacob Hendricks

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Rahul Daraad

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Bidisha Sarma

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United States
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