Steven Lee Email
VP of Packaging Engineering @ Chipletz
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Steven Lee Location
- Taiwan
Steven Lee Work
- 2025 -now VP of Packaging Engineering @
- 2004 -2025 Director, Packaging engineering _ External Manufacturing Operation @
- 2001 -2004 Sr Package Engineer @
- 1998 -2001 Sr Substrate design engineer @
Steven Lee Education
- 國立中山大學
Master's degree (EMBA)
2024-2026 - Feng Chia University
Master's degree (Material science and engineering)
2002-2004 - National Taiwan Ocean University
Bachelor's degree (Mechanical Engineering)
1991-1995
Steven Lee Skills
- IC
- Yield
- Management
- Cost Reduction
- Project Management
- Semiconductors
- Cross-functional Team Leadership
- Program Management
- Bump
- Flip Chip assembly and 2.5D process
- Flip Chip substrate
- Packaging
- Cross Functional Team Leadership
- Microsoft Excel
- SQL
- Graphic Design
- Six Sigma
- Engineering
Steven Lee Summary
- Steven Lee, based in Taiwan, is currently a VP of Packaging Engineering at Chipletz. Steven Lee brings experience from previous roles at AMD, VIA Technologies, Inc. and ASE Group - ASE (U.S.) INC.. Steven Lee holds a 2024 - 2026 Master's degree in EMBA @ 國立中山大學. With a robust skill set that includes IC, Yield, Management, Cost Reduction, Project Management and more. Steven Lee has 3 emails on RocketReach.
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