Ryan Sturza, based in Utica, MI, US, is currently a Lead Packaging Engineer at General Dynamics Land Systems. Ryan Sturza brings experience from previous roles at General Dynamics Land Systems, Stellantis and Packaging Corporation of America. Ryan Sturza holds a 2018 - 2022 Michigan State University. Ryan Sturza has 2 emails and 2 mobile phone numbers on RocketReach.
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