Electronic Assembler, Prewave and Postwave, Tape and Reel @ Volt
Ryan Kuhlmann's Education
ITT Technical Institute-Portland
Bachelor of Applied Science (B.A.Sc.) (Automated Manufacturing Technology)
1998 - 1999
ITT Technical Institute-Seattle
Bachelor of Applied Science (B.A.Sc.) (Electrical and Electronics Engineering)
1997 - 1998
ITT Technical Institute-Spokane Valley
Associate of Science (A.S.) (Electrical and Electronics Engineering)
1995 - 1997
Gonzaga University
Mechanical Engineering
1994 - 1995
Ryan Kuhlmann's Skills
Microsoft Office
Microsoft Excel
Microsoft Word
Research
PowerPoint
Leadership
Training
Photoshop
Computer Hardware
Ryan Kuhlmann's Summary
Ryan Kuhlmann, based in Portland, OR, US, is currently a IC Substrate Package Designer at Microsoft, bringing experience from previous roles at Mindlance and Intel Corporation. Ryan Kuhlmann holds a 1998 - 1999 Bachelor of Applied Science (B.A.Sc.) in Automated Manufacturing Technology @ ITT Technical Institute-Portland. With a robust skill set that includes Microsoft Office, Microsoft Excel, Microsoft Word, Research, PowerPoint and more, Ryan Kuhlmann contributes valuable insights to the industry. Ryan Kuhlmann has 2 emails on RocketReach.