Ryan Kuhlmann Email & Phone Number
IC Substrate Package Designer @ Microsoft
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Ryan Kuhlmann Location
- Portland, OR, US
Ryan Kuhlmann Work
- 2022 -now IC Substrate Package Designer @
- 2016 -2021 Printed Circuit Board Designer @
- 2007 -2016 Package Substrate Designer @
- 2004 -2007 PCB Designer - Mobile Client Footprint Librarian @
- 2000 -2004 Senior Engineering Technician - Analog Power Lab @
- 1997 -2000 Technician @
- 1995 -1997 Electronic Assembler, Prewave and Postwave, Tape and Reel @
Ryan Kuhlmann Education
- ITT Technical Institute-Portland
Bachelor of Applied Science (B.A.Sc.) (Automated Manufacturing Technology)
1998-1999 - ITT Technical Institute-Seattle
Bachelor of Applied Science (B.A.Sc.) (Electrical and Electronics Engineering)
1997-1998 - ITT Technical Institute-Spokane Valley
Associate of Science (A.S.) (Electrical and Electronics Engineering)
1995-1997 - Gonzaga University
(Mechanical Engineering)
1994-1995
Ryan Kuhlmann Summary
- Ryan Kuhlmann, based in Portland, OR, US, is currently a IC Substrate Package Designer at Microsoft. Ryan Kuhlmann brings experience from previous roles at Mindlance and Intel Corporation. Ryan Kuhlmann holds a 1998 - 1999 Bachelor of Applied Science (B.A.Sc.) in Automated Manufacturing Technology @ ITT Technical Institute-Portland. Ryan Kuhlmann has 3 emails and 1 mobile phone numbers on RocketReach.
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